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SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
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| Part No. |
Q68000-A4444 CGY40
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| Description |
From old datasheet system
GaAs MMIC (Single-stage monolithic microwave IC MMICamplifier Application range: 100 MHz to 3 GHz)
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| File Size |
30.36K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68000-401HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-232HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-434HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
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| Part No. |
CGY59 Q68000-A8887
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| Description |
GaAs MMIC (Low noise preamplifier for mobile communication PCN DECT GSM in 2.7V to 6V systems)
From old datasheet system
GaAs MMIC (Low noise preamplifier for mobile communication PCN, DECT, GSM in 2.7V to 6V systems)
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| File Size |
48.45K /
8 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68000-119HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-403HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-228HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-123HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-101HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
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| Part No. |
Q68000-A6887 CGY31
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| Description |
GaAs MMIC (Two-stage monolithic microwave IC MMIC amplifier All-gold metallization Chip fully passivated)
From old datasheet system
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| File Size |
137.77K /
9 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68000-110HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-102HALF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 2 Positions, 2.54 mm (0.100in) Pitch
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Official Product Page
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Bom2Buy.com
Price and Availability
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