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  6165 Datasheet PDF File

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    KP126N6165

Infineon Technologies AG
Part No. KP126N6165
Description Absolute Pressure Sensor

File Size 405.99K  /  24 Page

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Amphenol Communications Solutions

Part No. 54121-808361650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0761651108-17

Molex Electronics Ltd.
Part No. 0761651108-17
Description Impact 100 Ohm 3 Pair Vertical Backplane Header, Unguided, Open Endwall

File Size 35.60K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-109261650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    501616-5185 5016165185

Molex Electronics Ltd.
Part No. 501616-5185 5016165185
Description 0.30mm (.012) Pitch Easy-On Type FPC Connector, 1.10mm (.043) Mated Height, Right Angle, SMT

File Size 394.18K  /  5 Page

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Amphenol Communications Solutions

Part No. 54121-108361650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Fujitsu Limited
Part No. MB8116165B-50 MB8116165B-60
Description 1 M ×16 BIT Hyper Page Mode Dynamic RAM(CMOS 1 M ×16位超级页面存取模式动态RAM)
1 M ?16 BIT Hyper Page Mode Dynamic RAM(CMOS 1 M ?16浣??绾ч〉?㈠???ā寮????AM)

File Size 354.99K  /  29 Page

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Amphenol Communications Solutions

Part No. 54122-109161650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    KP236N6165

Infineon Technologies AG
Part No. KP236N6165
Description Analog Absolute Pressure Sensor

File Size 1,690.58K  /  25 Page

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Amphenol Communications Solutions

Part No. 54122-111161650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0554561659

Molex Electronics Ltd.
Part No. 0554561659
Description 1.25mm (.049) Pitch Mi ll System Wire-to-Board Header, Single Row, Right Angle,SMT, 16 Circuits, With Plastic Peg, Lead-free

File Size 304.58K  /  5 Page

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Amphenol Communications Solutions

Part No. 54122-809161650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Etron Tech
Part No. EM636165TS
Description 1M x 16 Synchronous DRAM

File Size 770.51K  /  74 Page

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Amphenol Communications Solutions

Part No. 54111-808161650LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Single Row, 16 Positions
Tech specs    

Official Product Page

    0761651125-17

Molex Electronics Ltd.
Part No. 0761651125-17
Description Impact 100 Ohm 3 Pair Vertical Backplane Header, Unguided, Dual Endwall

File Size 33.43K  /  2 Page

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    0761651107-17

Molex Electronics Ltd.
Part No. 0761651107-17
Description Impact 100 Ohm 3 Pair Vertical Backplane Header, Unguided, Open Endwall

File Size 35.60K  /  2 Page

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    0761651106-17

Molex Electronics Ltd.
Part No. 0761651106-17
Description Impact 100 Ohm 3 Pair Vertical Backplane Header, Unguided, Open Endwall

File Size 35.60K  /  2 Page

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Part: 61616-003
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