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  61010-102 Datasheet PDF File

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    0490161010 49016-1010

Molex Electronics Ltd.
Part No. 0490161010 49016-1010
Description 1.02/2.28mm (.040/.090) Tab, Hybrid Wire-to-Wire Housing, Male, 10 Circuits
File Size 126.85K  /  2 Page

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Amphenol Communications Solutions
Part No. 54112-106101000RLF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    EN50178 IEC61010-1

LEM
Part No. EN50178 IEC61010-1
Description Current Transducer LTS 6-NP
File Size 56.47K  /  3 Page

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Amphenol Communications Solutions
Part No. 10125756-361010LF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    MAXQ61010 MAXQ610J-0000

Maxim Integrated Products
Part No. MAXQ61010 MAXQ610J-0000
Description 16-Bit Microcontroller with Infrared Module
File Size 337.25K  /  29 Page

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Amphenol Communications Solutions
Part No. 10025026-10102TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    64326-1010 0643261010

Molex Electronics Ltd.
Part No. 64326-1010 0643261010
Description 2.50 mm (.098"), 4.20mm (.165") and 8.40mm, Power CMC Receptacles, 22 CircuitsRight Wire Output, Black Coding with Rear Seal Cover
2.50 mm (.098), 4.20mm (.165) and 8.40mm, Power CMC Receptacles, 22 CircuitsRight Wire Output, Black Coding with Rear Seal Cover
File Size 1,034.85K  /  6 Page

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Amphenol Communications Solutions
Part No. 54112-106101050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    51336-1010 0513361010

Molex Electronics Ltd.
Part No. 51336-1010 0513361010
Description 1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 10 Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 10 Circuits
File Size 99.07K  /  2 Page

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Amphenol Communications Solutions
Part No. 54122-106101000RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    5023961010 SD-502396-001 SD-502396-002

Molex Electronics Ltd.
Part No. 5023961010 SD-502396-001 SD-502396-002
Description 0.40mm (.016) Pitch SlimStack Board-to-Board Plug, SMT, Dual Row, Vertical Stacking, 2.50mm (.098)
0.40mm (.016") Pitch SlimStack Board-to-Board Plug, SMT, Dual Row, Vertical Stacking, 2.50mm (.098")
MOLEX Connector
File Size 309.88K  /  6 Page

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Amphenol Communications Solutions
Part No. 10025026-10100PLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x1, 36 Positions, 1.00mm (0.039in) Pitch .
Tech specs 　 　

Official Product Page

   
Part No. KVR266X72RC25/1024
Description 1024MB 266MHz DDR ECC Registered CL2.5 DIMM (64x4)
File Size 90.27K  /  1 Page

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Amphenol Communications Solutions
Part No. 10129206-1010001LF
Description DDR4 Ultra Low Profile Memory Module Sockets, Storage and Server System, Through Hole Termination, 288 Positions, 0.85mm (0.033in) Pitch.
Tech specs 　 　

Official Product Page

    RIA Connect
Part No. KVR133X72RC3L/1024
Description 1024MB 133MHz ECC Registered CL3 Low Profile DIMM 1024MB33MHz的ECC的超薄注册CL3内存
File Size 72.78K  /  1 Page

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Amphenol Communications Solutions
Part No. 59112-G36-10-100LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 20 Positions.
Tech specs 　 　

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    PHPT61010PY

NXP Semiconductors
Part No. PHPT61010PY
Description 100 V, 10 A PNP high power bipolar transistor
File Size 230.30K  /  16 Page

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Amphenol Communications Solutions
Part No. 79610-102
Description 2x10 PCB Header, Low Profile, Right Angle, 3.3mm (0.13inch) Solder tail, Off White
Tech specs 　 　

Official Product Page

   
Part No. THM361010AS-70
Description 1M X 36 MULTI DEVICE DRAM MODULE, 70 ns
File Size 57.93K  /  1 Page

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Amphenol Communications Solutions
Part No. 10084610-101LF
Description Mechanical Guidance Modules, Backplane Connectors, 10.8mm Guide Pin-External Thread.
Tech specs 　 　

Official Product Page

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