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  52117-0341 Datasheet PDF File

For 52117-0341 Found Datasheets File :: 142+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0521170240 52117-0240

Molex Electronics Ltd.
Part No. 0521170240 52117-0240
Description 2.50mm (.098") Pitch Splash Proof Wire-to-Wire Receptacle Housing, 2 Circuits
2.50mm (.098) Pitch Splash Proof Wire-to-Wire Receptacle Housing, 2 Circuits
File Size 137.75K  /  3 Page

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Amphenol Communications Solutions
Part No. 86130341024345E1LF
Description 8613 M LF CNR
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0521170241 52117-0241

Molex Electronics Ltd.
Part No. 0521170241 52117-0241
Description 2.50mm (.098") Pitch Splash Proof Wire-to-Wire Receptacle Housing, 2 Circuits
2.50mm (.098) Pitch Splash Proof Wire-to-Wire Receptacle Housing, 2 Circuits
File Size 137.74K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-110341200LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 34 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    0521170242 52117-0242

Molex Electronics Ltd.
Part No. 0521170242 52117-0242
Description 2.50mm (.098") Pitch Splash Proof Wire-to-Wire Receptacle Housing, 2 Circuits
2.50mm (.098) Pitch Splash Proof Wire-to-Wire Receptacle Housing, 2 Circuits
File Size 137.74K  /  3 Page

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Amphenol Communications Solutions
Part No. 10136656-0341LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 3 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs 　 　

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    0521170340 52117-0340

Molex Electronics Ltd.
Part No. 0521170340 52117-0340
Description 2.50mm (.098") Pitch Splash Proof Wire-to-Wire Receptacle Housing, 3 Circuits
2.50mm (.098) Pitch Splash Proof Wire-to-Wire Receptacle Housing, 3 Circuits
File Size 115.67K  /  3 Page

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Amphenol Communications Solutions
Part No. 10136647-034122LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, 30u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, Non GW Compatible, with out Posts, Tray packing.
Tech specs 　 　

Official Product Page

    0521170342 52117-0342

Molex Electronics Ltd.
Part No. 0521170342 52117-0342
Description 2.50mm (.098") Pitch Splash Proof Wire-to-Wire Receptacle Housing, 3 Circuits
2.50mm (.098) Pitch Splash Proof Wire-to-Wire Receptacle Housing, 3 Circuits
File Size 115.67K  /  3 Page

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Amphenol Communications Solutions
Part No. 86503-412HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    0521170410 52117-0410

Molex Electronics Ltd.
Part No. 0521170410 52117-0410
Description 2.00mm (.079) Pitch, Milli-Grid Crimp Housing, 12 Circuits, without CenterPolarization Key, without Locking Ramp, Leadfree
File Size 98.33K  /  2 Page

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Amphenol Communications Solutions
Part No. 380-3416-200
Description Receptacle MOD,NGM 4 Pair,15 Position,24.5MM, 85MΩ, w/lossy
Tech specs 　 　

Official Product Page

    0521170411 52117-0411

Molex Electronics Ltd.
Part No. 0521170411 52117-0411
Description 2.50mm (.098") Pitch Splash Proof Wire-to-Wire Receptacle Housing, 4 Circuits
2.50mm (.098) Pitch Splash Proof Wire-to-Wire Receptacle Housing, 4 Circuits
File Size 98.33K  /  2 Page

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Amphenol Communications Solutions
Part No. 86503-414HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    0521170413 52117-0413

Molex Electronics Ltd.
Part No. 0521170413 52117-0413
Description 2.50mm (.098") Pitch Splash Proof Wire-to-Wire Receptacle Housing, 2 Circuits, WideBody Type
2.50mm (.098) Pitch Splash Proof Wire-to-Wire Receptacle Housing, 2 Circuits, WideBody Type
File Size 98.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 54122-810341000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 34 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    Dialight Corp.
DIALIGHT[Dialight Corporation]
Part No. 568-0341-XXXX 568-0341-1113 568-0341-2223 568-0341-3333
Description 4X3 CBI ARRAY BLOCK
File Size 95.25K  /  1 Page

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Amphenol Communications Solutions
Part No. 380-3416-20W
Description Receptacle MOD,INFINX 4 Pair,15 Position,24.5MM, 85MΩ, w/lossy
Tech specs 　 　

Official Product Page

    Mitsubishi Electric Corporation
Part No. PS20341-N
Description DIP - IPM
File Size 171.58K  /  9 Page

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Amphenol Communications Solutions
Part No. 10136647-034142LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, Non GW Compatible, with out Posts, Tray packing.
Tech specs 　 　

Official Product Page

For 52117-0341 Found Datasheets File :: 142+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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