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  43650-0214 Datasheet PDF File

For 43650-0214 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43650-0328

Molex Electronics Ltd.
Part No. 43650-0328
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 3 Circuits

File Size 155.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021444-00020T4LF
Description Minitek127®, Wire to Board connector, IDC Receptacle, Double Row, 20 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43650-0923

Molex Electronics Ltd.
Part No. 43650-0923
Description
File Size 163.90K  /  3 Page

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Amphenol Communications Solutions

Part No. 87610-214LF
Description Quickie® Shrouded Low Profile Header, Wire To Board, Vertical, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0325

Molex Electronics Ltd.
Part No. 43650-0325
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab, 3 Circuits

File Size 170.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021444-00008T1LF
Description Minitek127®, Wire to Board connector, IDC Receptacle, Double Row, 8 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    43650-1123

Molex Electronics Ltd.
Part No. 43650-1123
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Press-fit Metal Retention Clip, 11 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 163.93K  /  3 Page

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Amphenol Communications Solutions

Part No. 68021-444HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-1124

Molex Electronics Ltd.
Part No. 43650-1124
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Solder Tab, 11 Circuits, Tin (Sn) Plating, Glow Wire Compatible

File Size 170.59K  /  3 Page

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Amphenol Communications Solutions

Part No. 68021-422HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 22 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-1126

Molex Electronics Ltd.
Part No. 43650-1126
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Solder Tab, 11 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Glow Wire Compatible

File Size 170.66K  /  3 Page

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Amphenol Communications Solutions

Part No. 69190-214HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0816

Molex Electronics Ltd.
Part No. 43650-0816
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Glow Wire Compatible

File Size 153.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-402-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0704

Molex Electronics Ltd.
Part No. 43650-0704
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Header, Surface Mount Compatible, Single Row,Right Angle, with Press-fit Metal Retention Clip, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 152.15K  /  3 Page

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Amphenol Communications Solutions

Part No. 68021-436HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0818

Molex Electronics Ltd.
Part No. 43650-0818
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit

File Size 169.20K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-807021400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0715

Molex Electronics Ltd.
Part No. 43650-0715
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Header, Surface Mount Compatible, Single Row,Vertical, with PCB Polarizing Peg, 7 Circuits, Tin (Sn) Plating, Glow Wire Compatible

File Size 153.60K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-502-14LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

For 43650-0214 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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