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  43045-0220 Datasheet PDF File

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    43045-1813

Molex Electronics Ltd.
Part No. 43045-1813
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits
File Size 166.55K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

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HUA FENG CIRCUIT





    43045-2420

Molex Electronics Ltd.
Part No. 43045-2420
Description
File Size 175.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-0808

Molex Electronics Ltd.
Part No. 43045-0808
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 184.25K  /  3 Page

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Amphenol Communications Solutions
Part No. 10134040-22000LF
Description HPCE CTB VT HEADER 4LP With latch
Tech specs 　 　

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    43045-2419

Molex Electronics Ltd.
Part No. 43045-2419
Description
File Size 175.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 68002-201HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1809

Molex Electronics Ltd.
Part No. 43045-1809
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 176.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 68002-203HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1208

Molex Electronics Ltd.
Part No. 43045-1208
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 68002-207HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1209

Molex Electronics Ltd.
Part No. 43045-1209
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 12 Circuits
File Size 176.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-802200800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1811

Molex Electronics Ltd.
Part No. 43045-1811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 180.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 84502-201
Description 300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array
Tech specs 　 　

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    43045-1800

Molex Electronics Ltd.
Part No. 43045-1800
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 94050-220CALF
Description Assembly, Top Mount, D/D(136Pins), R/A, 5V, 2mm s/o, Right Push Rod Eject, 8mm Card Travel, Narrow Body
Tech specs 　 　

Official Product Page

    43045-1801

Molex Electronics Ltd.
Part No. 43045-1801
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 470-2205-100
Description Receptacle. mod,20Positions, 20.5mm, NEXLEV
Tech specs 　 　

Official Product Page

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