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Molex, Inc.
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| Part No. |
15-25-4251 15-25-4171 15-25-4141 15-25-4081
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| Description |
Connector; Number of Contacts:25; Pitch Spacing:0.2"; Number of Rows:1; Mounting Type:PCB; Gender:Header 25 CONTACT(S), FEMALE, RIGHT ANGLE FFC/FPC CONNECTOR, SOLDER
Connector; No. of Contacts:17; Pitch Spacing:0.2"; No. of Rows:1; Mounting Type:PCB; Gender:Header 17 CONTACT(S), FEMALE, RIGHT ANGLE FFC/FPC CONNECTOR, SOLDER
Connector; Number of Contacts:14; Pitch Spacing:0.2"; Number of Rows:1; Mounting Type:PCB; Gender:Header 14 CONTACT(S), FEMALE, RIGHT ANGLE FFC/FPC CONNECTOR, SOLDER
100 FFC LIF Assy Brs Tin 8Ckt 8 CONTACT(S), FEMALE, RIGHT ANGLE FFC/FPC CONNECTOR, SOLDER
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| File Size |
89.97K /
1 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
79425-116HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79425-140HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79425-160HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 60 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10128425-11JLF
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| Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 10 column, 200 position, Right Angle Header, Right Guide Pin.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59112-G34-25-111LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions.
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Official Product Page
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SPANSION LLC
ADVANCED MICRO DEVICES INC
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| Part No. |
DS42516
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| Description |
SPECIALTY MEMORY CIRCUIT, PBGA73
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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| File Size |
535.12K /
58 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
79425-128HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79425-148HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79425-168HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 68 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-511061900LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Stacking Header, Surface Mount, Double row, 6 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79425-102HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Official Product Page
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Price and Availability
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