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  0838 Datasheet PDF File

For 0838 Found Datasheets File :: 126+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

    TOSHIBA[Toshiba Semiconductor]
Part No. 2SC3709A EE08388 2SC3709
Description NPN EPITAXIAL TYPE (HIGH CURRENT SWITCHING APPLICATIONS)
From old datasheet system

File Size 212.63K  /  4 Page

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Amphenol Communications Solutions

Part No. 10144518-083802LF
Description BergStak® Lite 0.80mm, Board-to-Board Connector, 80 Positions, Dual Row, Vertical Header.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0877600838 87760-0838

Molex Electronics Ltd.
Part No. 0877600838 87760-0838
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 8 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 8 Circuits, 2.54楼矛m (100楼矛) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-f

File Size 155.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 10144517-083802LF
Description BergStak® Lite 0.80mm, Board-to-Board Connector, 80 Positions, Dual Row, Vertical Receptacle.
Tech specs    

Official Product Page

    2SC3710 2SC3710A EE08389

TOSHIBA[Toshiba Semiconductor]
Part No. 2SC3710 2SC3710A EE08389
Description From old datasheet system
NPN EPITAXIAL TYPE (HIGH CURRENT SWITCHING APPLICATIONS)

File Size 212.56K  /  4 Page

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    K4H560838H

Samsung semiconductor
Part No. K4H560838H
Description (K4H560438H - K4H561638H) 256Mb H-die DDR SDRAM Specification

File Size 386.61K  /  24 Page

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    Samsung
Part No. K4H560838N
Description 256Mb N-die DDR SDRAM

File Size 318.45K  /  24 Page

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    TB62707 TB62707F E008381

Toshiba Semiconductor
Part No. TB62707 TB62707F E008381
Description 8BIT LATCHES & CONSTANT CURRENT DRIVERS
From old datasheet system

File Size 372.18K  /  11 Page

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Part No. K4H560838E-NLB3
Description 32M X 8 DDR DRAM, 0.7 ns, PDSO54

File Size 213.06K  /  24 Page

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    SAMSUNG[Samsung semiconductor]
Part No. K4H510838B-VC_LCC K4H510838B-N K4H510838B-NC_LA2 K4H510838B-NC_LB0 K4H510838B-NC_LB3 K4H510838B-NC_LCC K4H510838B-VC_LA2 K4H510838B-VC_LB0 K4H510838B-VC_LB3
Description 512Mb B-die DDR SDRAM Specification 54 sTSOP-II (400mil x 441mil)

File Size 341.67K  /  24 Page

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    K4H510838B-NC/LA2 K4H510838B-NC/LB0 K4H510838B-NC/LB3 K4H510838B-NC/LCC K4H510838B-VC/LCC K4H510838B-VC/LB3 K4H510838B-V

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H510838B-NC/LA2 K4H510838B-NC/LB0 K4H510838B-NC/LB3 K4H510838B-NC/LCC K4H510838B-VC/LCC K4H510838B-VC/LB3 K4H510838B-VC/LA2 K4H510838B-VC/LB0 K4H510838B-N
Description 512Mb B-die DDR SDRAM Specification 54 sTSOP-II (400mil x 441mil) 512MB的乙芯片DDR SDRAM内存规格54 sTSOP -Ⅱ(400mil x 441mil

File Size 346.41K  /  24 Page

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    K4H560838E-GCCC K4H560838E-GCC4

Samsung semiconductor
Part No. K4H560838E-GCCC K4H560838E-GCC4
Description    256Mb E-die DDR 400 SDRAM Specification 60Ball FBGA (x4/x8)

File Size 198.99K  /  18 Page

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