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| Part No. |
AN-9037
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| OCR Text |
... solder process will typically yield solder fillets to the ends of the lead due to the cleaning action of the flux in the solder paste. figure 2 : exposed copper on package edge from singulation process. pwb design considerations a... |
| Description |
8x8 MLP DriverMOS Packaging
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| File Size |
749.51K /
7 Page |
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| Part No. |
AN-9040
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| OCR Text |
... solder process will typically yield solder fillets to the ends of the lead due to the cleaning action of the flux in the solder paste. figure 2 : solder wetted to lead-frame copper exposed by singulation on lead ends.
pwb design ... |
| Description |
Power33 Packaging
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| File Size |
299.73K /
7 Page |
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it Online |
Download Datasheet |
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http://
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| Part No. |
AN-9046
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| OCR Text |
...tprint to assure best assembly yield, thermal performance and overall system performance. pad finish the dual power56 is sold with a nipdau lead free lead finish. immersion silver, immersion nickel gold and organic surface protectan... |
| Description |
Dual Power56 Packaging
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| File Size |
850.15K /
10 Page |
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it Online |
Download Datasheet |
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http://
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| Part No. |
AN-9048
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| OCR Text |
... solder process will typically yield solder fillets to the ends of the lead due to the cleaning action of the flux in the solder paste. pwb design considerations any land pad pattern must take into account the various tolerances inv... |
| Description |
6x6 DriverMOS Packaging
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| File Size |
746.79K /
9 Page |
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it Online |
Download Datasheet |
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GE
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| Part No. |
LEXAN920
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| OCR Text |
... ge method tensile stress, yield, 50 mm/min 63 mpa iso 527 tensile stress, break, 50 mm/min 60 mpa iso 527 tensile strain, yield, 50 mm/min 6 % iso 527 tensile strain, brea... |
| Description |
Europr Africa Middle East COMMERCIAL
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| File Size |
151.26K /
4 Page |
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it Online |
Download Datasheet |
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Price and Availability
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