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unsawn Datasheet PDF File

For unsawn Found Datasheets File :: 292 Search Time::1.031ms
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				意法半导 ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
Part No.	STDELIV SMARTCARD ST19SF08CD45XXXZ
OCR Text	...uction need, ST offers sawn and unsawn wafers deliveries, listed in Table 3. Figure 1. Delivery form s 4 4 Table 1. Micromodules in super 35 standard tape Type D1, D2 D15 D3, D4 D5 D68 D7 C7 D8 Description 8 contacts for memory cards ...
Description	ORDERING INFORMATION FOR PACKAGE AND DELIVERY ORDERING INFORMATION FOR PACKAGE AND DELIVERY
File Size	31.03K / 2 Page	View it Online	Download Datasheet

				INFINEON TECHNOLOGIES AG
Part No.	SLE4406SPEC SLE4406SPEMFC3 SLE4406SPEM3
OCR Text	... sle 4406sp c die (on wafer) unsawn sle 4406sp d die (on wafer) sawn sle 4406sp m3 t-m3.2-6 sle 4406sp mfc3 s-mfc3.1-6-1 fcos? data of 3rd byte are programmed by infineon exclusively sle 4406spe c die (on wafer) unsawn sle ...
Description	512 X 1 EEPROM 5V, UUC 512 X 1 EEPROM 5V, DMA
File Size	257.30K / 6 Page	View it Online	Download Datasheet

				Philips
Part No.	SL1ICS3101 SL1ICS3101W/N4D
OCR Text	...GE TYPE NUMBER NAME DESCRIPTION unsawn wafer; 150 m; inked and mapped sawn wafer on foil (FFC); 150 m; inked and mapped VERSION - - SL1ICS3101U SL1ICS3101W wafer wafer 2002 May 23 3 Philips Semiconductors Product specifica...
Description	SL1ICS3101; I-CODE1 Label IC (97 pF)
File Size	152.46K / 20 Page	View it Online	Download Datasheet

				VISHAY INTERTECHNOLOGY INC
Part No.	SC202H045A5B SC202R030A5B
OCR Text	...25c sc202....5 b . inked probed unsawn wafer (wafer in box) 48 device t j max. v r max. i r @ 25c (*) max. v f @ i f # (c) (v) (ma) (v) electrical characteristics device metal thickness metal thickness # front metal back metal sc202......
Description	45 V, SILICON, RECTIFIER DIODE 30 V, SILICON, RECTIFIER DIODE
File Size	131.01K / 5 Page	View it Online	Download Datasheet

				Philips
Part No.	SL1ICS3001 SL1ICS3001W/N4D
OCR Text	...GE TYPE NUMBER NAME DESCRIPTION unsawn wafer; 150 m; inked and mapped sawn wafer on foil (FFC); 150 m; inked and mapped VERSION - - SL1ICS3001U SL1ICS3001W wafer wafer 2002 May 23 3 Philips Semiconductors Product specifica...
Description	SL1ICS3001; I-CODE1 Label IC
File Size	152.22K / 20 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	SC202 SC202H100A5 SC202SXXXA5
OCR Text	...25c sc202....5 b . inked probed unsawn wafer (wafer in box) 48 device t j max. v r max. i r @ 25c (*) max. v f @ i f # (c) (v) (ma) (v) electrical characteristics device metal thickness metal thickness # front metal back metal sc202......
Description	Schottky Die 200 x 200 Mils
File Size	138.70K / 4 Page	View it Online	Download Datasheet


Part No.	SC202S045A5BPBF SC202H100A5B
OCR Text	...25c sc202....5 b . inked probed unsawn wafer (wafer in box) 48 device t j max. v r max. i r @ 25c (*) max. v f @ i f # (c) (v) (ma) (v) electrical characteristics device metal thickness metal thickness # front metal back metal sc202......
Description	45 V, SILICON, RECTIFIER DIODE 100 V, SILICON, RECTIFIER DIODE
File Size	108.07K / 4 Page	View it Online	Download Datasheet

				NXP SEMICONDUCTORS
Part No.	PCA8565AU/5BA/1
OCR Text	...u wire bond die; 9 bonding pads unsawn wafer; thickness 280 m m pca8565au die type 2 pca8565au/5bb/1 pca8565au wire bond die; 9 bonding pads unsawn wafer; thickness 280 m m pca8565au table 2. marking codes type number marking code pca8565au...
Description	REAL TIME CLOCK, UUC9
File Size	162.57K / 38 Page	View it Online	Download Datasheet

For unsawn Found Datasheets File :: 292 Search Time::1.031ms
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