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  sot549-1 Datasheet PDF File

For sot549-1 Found Datasheets File :: 24    Search Time::1.469ms    
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    UJA1069 UJA1069TW

NXP Semiconductors
Part No. UJA1069 UJA1069TW
OCR Text ...mall outline package; 32 leads; sot549-1 body width 6.1 mm; lead pitch 0.65 mm; exposed die pad plastic thermal enhanced thin shrink small outline package; 24 leads; SOT864-1 body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Type numbe...
Description LIN fail-safe system basis chip

File Size 285.32K  /  64 Page

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    TDA8932BT TDA8932B TDA8932BTW TDA8932BTW/N2518 TDA8932B-15

NXP Semiconductors
Part No. TDA8932BT TDA8932B TDA8932BTW TDA8932BTW/N2518 TDA8932B-15
OCR Text ...y width 7.5 mm Version SOT287-1 sot549-1 Type number TDA8932BTW HTSSOP32 plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad TDA8932B_4 (c) NXP B.V. 2008. All...
Description Class-D audio amplifier
Class-D audio amplifier; Package: sot549-1 (HTSSOP32); Container: Reel Dry Pack, SMD, 13&quot;
   Class-D audio amplifier

File Size 299.64K  /  48 Page

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    UJA106110

NXP Semiconductors
Part No. UJA106110
OCR Text ...mall outline package; 32 leads; sot549-1 body width 6.1 mm; lead pitch 0.65 mm; exposed die pad Type number [1] UJA1061TW/5V0 is for the 5 V version; UJA1061TW/3V3 is for the 3.3 V version. 4. Block diagram BAT42 32 BAT MO...
Description Fault-tolerant CAN/LIN fail-safe system basis chip

File Size 494.95K  /  77 Page

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    UJA1065 UJA1065TW

NXP Semiconductors
Part No. UJA1065 UJA1065TW
OCR Text ...mall outline package; 32 leads; sot549-1 body width 6.1 mm; lead pitch 0.65 mm; exposed die pad Type number[1] [1] UJA1065TW/5V0 is for the 5 V version; UJA1065TW/3V3 is for the 3.3 V version. 4. Block diagram SENSE BAT42 BAT14 ...
Description High-speed CAN/LIN fail-safe system basis chip

File Size 446.36K  /  76 Page

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    UJA1066 UJA1066TW

NXP Semiconductors
Part No. UJA1066 UJA1066TW
OCR Text ...mall outline package; 32 leads; sot549-1 body width 6.1 mm; lead pitch 0.65 mm; exposed die pad Type number[1] [1] UJA1066TW/5V0 is for the 5 V version; UJA1066TW/3V3 is for the 3.3 V version. 4. Block diagram SENSE BAT42 BAT14 ...
Description High-speed CAN fail-safe system basis chip

File Size 445.78K  /  70 Page

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    UJA106909

NXP Semiconductors
Part No. UJA106909
OCR Text ...mall outline package; 32 leads; sot549-1 body width 6.1 mm; lead pitch 0.65 mm; exposed die pad plastic thermal enhanced thin shrink small outline package; 24 leads; SOT864-1 body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Type numbe...
Description LIN fail-safe system basis chip

File Size 279.16K  /  64 Page

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    UJA1075 UJA1075TW_3V3 UJA1075TW_3V3_WD UJA1075TW_5V0 UJA1075TW_5V0_WD UJA1075TW/3V3 UJA1075TW/3V3/WD UJA1075TW/5V0 UJA10

NXP Semiconductors N.V.
Part No. UJA1075 UJA1075TW_3V3 UJA1075TW_3V3_WD UJA1075TW_5V0 UJA1075TW_5V0_WD UJA1075TW/3V3 UJA1075TW/3V3/WD UJA1075TW/5V0 UJA1076TW/3V3112 UJA1075TW/3V3118 UJA1076TW/3V3118 UJA1075TW/3V3112 UJA1075TW/5V0112 UJA1076TW/5V0112 UJA1076TW/5V0118 UJA1075TW/5V0/WD
OCR Text ... mm; exposed die pad Version sot549-1 HTSSOP32 4. Block diagram UJA1075 BAT V1 V2 GND V1 UV V2 UV EXT. PNP CTRL VEXCTRL VEXCC WBIAS V1 V2 SCK SDI SDO SCSN WAKE1 WAKE2 WDOFF EN DLIN BAT WAKE SYSTEM CONTROLLER INTN RSTN OSC...
Description High-speed CAN/LIN core system basis chip

File Size 360.00K  /  53 Page

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    UJA1076 UJA1076TW_3V3 UJA1076TW_3V3_WD UJA1076TW_5V0 UJA1076TW_5V0_WD UJA1076TW/5V0 UJA1076TW/3V3/WD PCF8534AHL/1518 UJA

NXP Semiconductors N.V.
Part No. UJA1076 UJA1076TW_3V3 UJA1076TW_3V3_WD UJA1076TW_5V0 UJA1076TW_5V0_WD UJA1076TW/5V0 UJA1076TW/3V3/WD PCF8534AHL/1518 UJA1076TW/5V0/WD
OCR Text ... mm; exposed die pad Version sot549-1 HTSSOP32 4. Block diagram UJA1076 BAT V1 V2 GND V1 UV V2 UV EXT. PNP CTRL VEXCTRL VEXCC WBIAS V1 V2 SCK SDI SDO SCSN WAKE1 WAKE2 WDOFF EN WAKE SYSTEM CONTROLLER INTN RSTN OSC TEMP LIM...
Description DATACOM, ETHERNET TRANSCEIVER, PDSO32
High-speed CAN core system basis chip

File Size 315.34K  /  47 Page

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    TDA8261TW

Philips Semiconductors
NXP Semiconductors
Part No. TDA8261TW
OCR Text ....65 mm; exposed die pad VERSION SOT549-3 2004 Dec 02 3 Philips Semiconductors Product specification Satellite Zero-IF QPSK/8...1 2 OSCILLATOR f XTAL REFERENCE DIVIDER TDA8261TW DIGITAL PHASE COMPARATOR f COMP CHARGE PUMP ...
Description Satellite Zero-IF QPSK/8PSK downconverter with PLL synthesizer

File Size 124.22K  /  22 Page

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    UJA1079

NXP Semiconductors
Part No. UJA1079
OCR Text ... mm; exposed die pad Version sot549-1 HTSSOP32 UJA1079_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 1 December 2009 3 of 44 NXP Semiconductors UJA1079 LIN core system basis chip 4. ...
Description LIN core system basis chip

File Size 367.14K  /  44 Page

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For sot549-1 Found Datasheets File :: 24    Search Time::1.469ms    
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