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SK3A5P0 43650 OP400GS BV55BE MMBD3004 SS411 MMBD3004 2322168
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    TN0991

STMicroelectronics
Part No. TN0991
Description Description of WLCSP for STMicroelectronics EEPROMs and recommendations for use

File Size 698.23K  /  21 Page

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    SGS Thomson Microelectronics
Part No. AN899
Description MCUS - SOLDERING recommendations AND PACKAGING INforMATION

File Size 129.83K  /  12 Page

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    SGS Thomson Microelectronics
Part No. AN1235
Description FLIP-CHIP CSP: PACKAGE DESCRIPTION AND recommendations for USE

File Size 85.46K  /  8 Page

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    PLL[PhaseLink Corporation]
Part No. TB502-3X-520-XX
Description Test Board for chip evaluation and Layout recommendations

File Size 39.43K  /  2 Page

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    http://
Part No. AN-902
Description Twisted Pair FDDI Magnetics Overview and recommendations

File Size 210.07K  /  10 Page

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    SGS Thomson Microelectronics
Part No. AN1547
Description FLIP CHIP 170MICRONSM recommendations for AUDIO POWER AMPLIFIERS

File Size 68.82K  /  6 Page

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    TN1171

STMicroelectronics
Part No. TN1171
Description Description of UFDFPN5, UFDFPN8 and WFDFPN8 for STMicroelectronics EEPROMs and recommendations for use

File Size 556.77K  /  26 Page

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    SGS Thomson Microelectronics
Part No. AN1553
Description FLIP CHIP 300MICRONSM recommendations for AUDIO POWER AMPLIFIER

File Size 68.17K  /  6 Page

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    CONSUMER MICROCIRCUITS LIMITED
Part No. V.23
Description recommendations for V.23 1200/75bps Full-Duplex Call Set-Up

File Size 47.14K  /  1 Page

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    AN1580

Motorola, Inc
Part No. AN1580
Description MOUNTING AND SOLDERING recommendations for THE MOTOROLA POWER FLAT PACK PACKAGE

File Size 123.59K  /  4 Page

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