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heating cooling Datasheet PDF File

For heating cooling Found Datasheets File :: 2883 Search Time::0.813ms
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				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	74AHCT1G32 74AHCT1G32GW 74AHC1G32 74AHC1G32GW 74AHC1G32GW/T1
OCR Text	...or example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. Th...
Description	IC-SM-CMOS LOGIC 2-input OR gate
File Size	80.51K / 12 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	74AHCT1G86 74AHCT1G86GW 74AHC1G86 74AHC1G86GW
OCR Text	...or example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. Th...
Description	2-input EXCLUSIVE-OR gate
File Size	61.06K / 12 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC
Part No.	AT5608
OCR Text	...ection or IR/Convction Average heating Rate(180C to peak) Preheat Temperature(12520C) Temperature maintained above 180C Time within 5C of actual Peak Temperature Peak Temperature Range(Note 1) cooling Rate Time 25C to Peak Temperature 5C/s...
Description	Bi-directional Motor Driver
File Size	203.38K / 7 Page	View it Online	Download Datasheet

				Motorola, Inc. ON Semiconductor
Part No.	BAS40-04LT1 ON0119
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperat...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description	Dual Series Schottky Diode(高速开关应用，-0.50V正向电压，反向电0V的双肖特基势垒二极管) From old datasheet system SCHOTTKY BARRIER DIODES
File Size	73.00K / 4 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	BAS40-06LT1 BAS40-06LT1/D
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperat...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description	PSoC® Mixed-Signal Array SCHOTTKY BARRIER DIODE
File Size	74.38K / 4 Page	View it Online	Download Datasheet

				Motorola, Inc. Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAS4004LT1
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperat...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description	CASE 318 08/ STYLE 12 SOT 23 (TO 236AB) CASE 318 08, STYLE 12 SOT 23 (TO 236AB)
File Size	73.08K / 4 Page	View it Online	Download Datasheet

				Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAS4006LT1
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperat...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description	CASE 318-08/ STYLE 11 SOT-23 (TO-236AB) CASE 318-08, STYLE 11 SOT-23 (TO-236AB)
File Size	74.33K / 4 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAS40LT1 ON0121 BAS4
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperat...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description	CASE 318-08, STYLE 8 SOT-23 TO-236AB SILICON, SIGNAL DIODE, TO-236AB CASE 318-08/ STYLE 8 SOT-23 TO-236AB From old datasheet system
File Size	71.42K / 4 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc]
Part No.	BCP56T1 BCP56T1SERIES
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description	MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT 中功率NPN硅高当前的晶体管表面贴装
File Size	200.38K / 6 Page	View it Online	Download Datasheet

				Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BCP68T1
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description	MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT
File Size	149.51K / 6 Page	View it Online	Download Datasheet

For heating cooling Found Datasheets File :: 2883 Search Time::0.813ms
Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |