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IRF[International Rectifier]
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| Part No. |
AN-994-1
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| OCR Text |
...fficient heat to simultaneously fuse all the connections on the component to be replaced without overheating the adjacent components on the substrate itself. Soldering irons with specially shaped tips are usually used for this purpose and b... |
| Description |
MAXIMIZING THE EFFECTIVENESS OF YOUR smD ASSEMBLIES
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| File Size |
117.08K /
7 Page |
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it Online |
Download Datasheet
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VICOR[Vicor Corporation]
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| Part No. |
B048K030T21 B048K030M21
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| OCR Text |
...d on the load side of the input fuse. The connection of the V*I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC dampe... |
| Description |
VI Chip - BCM Bus Converter Module
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| File Size |
562.83K /
15 Page |
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it Online |
Download Datasheet |
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Vicor, Corp.
VICOR[Vicor Corporation]
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| Part No. |
B048K060T24 B048F060M24 B048F060T24 B048K060M24
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| OCR Text |
...d on the load side of the input fuse. The connection of the V*I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC dampe... |
| Description |
VI Chip - BCM Mus Converter Module 六芯 BCM的小家鼠转换器模
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| File Size |
563.21K /
15 Page |
View
it Online |
Download Datasheet |
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Vicor, Corp.
VICOR[Vicor Corporation]
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| Part No. |
B048K096T24 B048F096M24 B048F096T24 B048K096M24
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| OCR Text |
...d on the load side of the input fuse. The connection of the V*I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC dampe... |
| Description |
0.5MM RASTER 2 ROW X 10 CONTACTS 六ChipTM - BCM的总线转换器模
VI ChipTM - BCM Bus Converter Module
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| File Size |
564.66K /
15 Page |
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it Online |
Download Datasheet |
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Vicor, Corp.
VICOR[Vicor Corporation]
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| Part No. |
B048K120T30 B048F120M30 B048F120T30 B048K120M30
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| OCR Text |
...d on the load side of the input fuse. The connection of the V*I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC dampe... |
| Description |
VI Chip - BCM Bus Converter Module 六芯 BCM的总线转换器模
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| File Size |
567.78K /
15 Page |
View
it Online |
Download Datasheet |
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VICOR[Vicor Corporation]
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| Part No. |
B048K160T24 B048F160M24 B048F160T24 B048K160M24
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| OCR Text |
...d on the load side of the input fuse. The connection of the V*I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC dampe... |
| Description |
VI Chip - BCM Bus Converter Module
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| File Size |
574.98K /
15 Page |
View
it Online |
Download Datasheet |
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Vicor, Corp.
VICOR[Vicor Corporation]
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| Part No. |
B048K480T30 B048F480M30 B048F480T30 B048K480M30
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| OCR Text |
...d on the load side of the input fuse. The connection of the V*I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC dampe... |
| Description |
VI Chip - BCM Bus Converter Module 六芯 BCM的总线转换器模
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| File Size |
580.09K /
15 Page |
View
it Online |
Download Datasheet |
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VICOR[Vicor Corporation]
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| Part No. |
B048L120T10 B048F120T10 B048G120T10 B048K120T10
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| OCR Text |
...d on the load side of the input fuse. The connection of the V*I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC dampe... |
| Description |
VI Chip - BCM Bus Converter Module
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| File Size |
722.67K /
16 Page |
View
it Online |
Download Datasheet |
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VICOR[Vicor Corporation]
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| Part No. |
B048L120T15 B048F120T15 B048G120T15 B048K120T15
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| OCR Text |
...d on the load side of the input fuse. The connection of the V*I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC dampe... |
| Description |
VI Chip - BCM Bus Converter Module
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| File Size |
515.83K /
16 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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