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eutectic Datasheet PDF File

For eutectic Found Datasheets File :: 3744 Search Time::0.719ms
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				MICROSEMI[Microsemi Corporation]
Part No.	MXP22-C
OCR Text	...tion - Gold Die Attach methods: eutectic or Epoxy o Electrical Characteristic 25 s@ SYMBOL VOC ISC VB C CONDITIONS 10 mW/cm2, wavelength = 850 nm 10 mW/cm2, wavelength = 850 nm IR = 10 uA MIN 10 3.5 20 TYP MAX UNITS Volts uA Volts ...
Description	Multi Element Opto Arrays Monolithic Photodiode Array-Chip
File Size	37.65K / 1 Page	View it Online	Download Datasheet

				MICROSEMI[Microsemi Corporation]
Part No.	MXP415-C MSC1342
OCR Text	...tion - Gold Die Attach methods: eutectic or Epoxy Electrical Characteristics @ 25oC SYMB OL BVCEO BVEBO BVCBO VCESAT ID hFE CHARACT ERIST IC Collector-Emitter Voltage Emitter-Base Voltage Collector-Base Voltage Collector-Emitter Sa...
Description	Photo Transistor Chip From old datasheet system Photoconductive Detectors
File Size	36.58K / 1 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LPV3000 LP3000
OCR Text	...ommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280290C; maximum time at temperature is 1 min. The recommended wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil...
Description	2W Power PHEMT
File Size	46.89K / 2 Page	View it Online	Download Datasheet

				http:// MINI[Mini-Circuits]
Part No.	DBTC-6-4-75 DBTC-75OHMSSERIES DBTC-10-4-75 DBTC-13-5-75 DBTC-16-5-75 DBTC-18-4-75 DBTC-20-4-75
OCR Text	... recommended; however, tin-lead eutectic (Sn/Pb 63/37%) may be used. For temperature profiles, see Application Note AN-40-004 Mini-Circuits INTERNET http://www.minicircuits.com P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-...
Description	Circular Connector; Body Material:Aluminum; Series:PT01; No. of Contacts:15; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Cable Receptacle; Circular Contact Gender:Pin; Insert Arrangement:14-15 Surface Mount Directional Couplers 表面贴装定向耦合 Surface Mount Directional Couplers 5 MHz - 1000 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 2.2 dB INSERTION LOSS-MAX Surface Mount Directional Couplers 5 MHz - 1500 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 2.2 dB INSERTION LOSS-MAX Surface Mount Directional Couplers 5 MHz - 1500 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 2 dB INSERTION LOSS-MAX Surface Mount Directional Couplers 5 MHz - 1250 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 3.1 dB INSERTION LOSS-MAX
File Size	141.57K / 2 Page	View it Online	Download Datasheet

				AD[Analog Devices]
Part No.	AD96685 AD96685BH AD96685BP AD96685BP-REEL AD96685BQ AD96685BR AD96685TQ AD96687 AD96687BP AD96687BQ AD96687BR AD96687BR-REEL AD96687TQ
OCR Text	... . . . . . . . . . . . . . Gold eutectic Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding or 1 mil, Gold, Gold Ball Bonding Die Dimensions (AD96687) . . . . . . . . 77 60 15 ( 2) mils Pad Dimensions . . . . . . . . . . . ...
Description	Ultrafast Comparators
File Size	121.42K / 6 Page	View it Online	Download Datasheet

				Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)]
Part No.	MSA-0400
OCR Text	...nded assembly procedure is gold-eutectic die attach at 400C and either wedge or ball bonding using 0.7 mil gold wire. See APPLICATIONS section, "Chip Use". Chip Outline[1] Description The MSA-0400 is a high performance silicon bipola...
Description	Cascadable Silicon Bipolar MMIC Amplifier
File Size	49.94K / 4 Page	View it Online	Download Datasheet

				Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)]
Part No.	MSA-0800 MSA-0800-GP4
OCR Text	...nded assembly procedure is gold-eutectic die attach at 400C and either wedge or ball bonding using 0.7 mil gold wire.[1] See APPLICATIONS section, "Chip Use". Chip Outline[1] Note: 1. Refer to the APPLICATIONS section "Silicon MMIC Ch...
Description	Cascadable Silicon Bipolar MMIC Amplifier
File Size	70.16K / 4 Page	View it Online	Download Datasheet

				Intersil, Corp. HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
Part No.	MSA-0900 MSA-0900-GP4
OCR Text	...nded assembly procedure is gold-eutectic die attach at 400C and either wedge or ball bonding using 0.7 mil gold wire. This chip is intended to be used with an external blocking capacitor completing the shunt feedback path (closed loop). Dat...
Description	Cascadable Silicon Bipolar MMIC Amplifier 级联硅双极MMIC放大
File Size	50.54K / 4 Page	View it Online	Download Datasheet

				AD[Analog Devices]
Part No.	AD9300 AD9300KP AD9300KQ AD9300TE_883B AD9300TQ_883B
OCR Text	... . . . . . . . . . . . . . Gold eutectic Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding or 1 mil, Gold; Gold Ball Bonding MECHANICAL INFORMATION LOGIC TRUTH TABLE ENABLE 0 1 1 1 1 AD9300 Timing Diagram A1 X 0 ...
Description	4 x 1 Wideband Video Multiplexer
File Size	150.81K / 8 Page	View it Online	Download Datasheet

For eutectic Found Datasheets File :: 3744 Search Time::0.719ms
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