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AMI[AMI SEMICONDUCTOR]
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| Part No. |
AMIS-710414-A4 AMIS-710414
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| OCR Text |
...414-A4 module. These 27 sensors bonded on a printed circuit board (PCB) are grouped into four sub-cascaded sections. Each contiguously casca...pairs per inch.
8.0 Recommended Operating Conditions
The tabled values are measured at 25C.
Tab... |
| Description |
400dpi CIS Module Four Parallel Video Outputs for RED IR Light Source
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| File Size |
199.81K /
7 Page |
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it Online |
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HOLTEK[Holtek Semiconductor Inc]
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| Part No. |
HTG1390 1390
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| OCR Text |
...9 935.39
These pins must be bonded out for functional testing.
4
17th Nov '98
Preliminary
Pad Description
Pad No.
17, 18 8 9...pairs R0,R1 and R2,R3 are used as a data memory pointer when the memory transfer instruction is exec... |
| Description |
From old datasheet system
4-bit Microcontroller
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| File Size |
423.31K /
27 Page |
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it Online |
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MICROSEMI[Microsemi Corporation]
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| Part No. |
LX5261CDP LX5261
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| OCR Text |
...ed to die mounting pad, but not bonded to GND pin. Pins should be considered a heat sink only, and not a true ground connection. It is recom...pairs.
1.75V +/- 0.05V 200mA source/sink 6 475 1%
+ -
VOUT1
27
Ln-
Parameter
121 1 ... |
| Description |
27-Line LVD SCSI Source/Sink Regulator
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| File Size |
144.87K /
6 Page |
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it Online |
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SiGe Semiconductor, Inc...
SIGE[SiGe Semiconductor, Inc.]
SiGe Semiconductor Inc.
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| Part No. |
SE1000W
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| OCR Text |
... chip. Only one pad needs to be bonded. Input pad (connect to photodetector cathode). Negative supply (0V) - Note this is separate ground fo...pairs are connected on-chip and only one pad of each type is required to be bonded out. Mechanical d... |
| Description |
LightChargerTM155 Mb/s Transimpedance Amplifier Final
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| File Size |
114.19K /
9 Page |
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it Online |
Download Datasheet |
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SiGe Semiconductor Inc.
SIGE[SiGe Semiconductor, Inc.]
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| Part No. |
SE1010W
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| OCR Text |
... chip. Only one pad needs to be bonded. Input pad (connect to photodetector cathode). Negative supply (0V) - Note this is separate ground fo...pairs are connected on-chip and only one pad of each type is required to be bonded out. Mechanical d... |
| Description |
LightChargerTM 622 Mb/s Transimpedance Amplifier Final
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| File Size |
114.08K /
9 Page |
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it Online |
Download Datasheet |
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