amkor pdf Datasheet P2 Description --- IC-ON-LINE


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amkor Datasheet PDF File

For amkor Found Datasheets File :: 35+ Page :: | 1 | <2> | 3 | 4 |

					amkor Technology
Part No.	CPGA
Description	Ceramic Pin Grid Array Package
File Size	528.64K / 1 Page	View it Online	Download Datasheet

					amkor Technology
Part No.	CSPNL
Description	Wafer Level Packaging
File Size	153.88K / 2 Page	View it Online	Download Datasheet

					amkor Technology
Part No.	POWERSOP
Description	Power Small Outline Package,PowerSOP
File Size	305.99K / 2 Page	View it Online	Download Datasheet

					amkor Technology
Part No.	CERAMIC HERMETIC
Description	Glass or solder seal up to 435C
File Size	144.54K / 1 Page	View it Online	Download Datasheet

					amkor Technology
Part No.	SO8-FL
Description	Interconnect - Cu clips technology for better electrical and thermal
File Size	733.46K / 2 Page	View it Online	Download Datasheet

					amkor Technology
Part No.	WLCSP
Description	Wafer Level Processing and Die Processing Services
File Size	467.70K / 2 Page	View it Online	Download Datasheet

					amkor Technology
Part No.	TSON8-FL
Description	Bare copper leadframe with no plating
File Size	729.20K / 2 Page	View it Online	Download Datasheet

					amkor Technology
Part No.	QSOP
Description	Shrink Small Outline, Quarter-Size Small-Outline Packages
File Size	414.59K / 2 Page	View it Online	Download Datasheet

					amkor Technology
Part No.	FUSIONQUAD
Description	Increased I/O (116 to 356) in smaller package footprints
File Size	378.71K / 2 Page	View it Online	Download Datasheet

					amkor Technology
Part No.	FCBGA
Description	Package sizes from 10 mm to 55 mm (60 mm and 65 mm in development)
File Size	407.80K / 2 Page	View it Online	Download Datasheet

For amkor Found Datasheets File :: 35+ Page :: | 1 | <2> | 3 | 4 |

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