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  90143-0120 Datasheet PDF File

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    90143-0050

Molex Electronics Ltd.
Part No. 90143-0050
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 50 Circuits
File Size 250.24K  /  2 Page

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Rochester Electronics LLC
Part No. 27C010-120DI
Description 27C010 - 1024K (128K x 8) CMOS EPROM
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    90143-0012

Molex Electronics Ltd.
Part No. 90143-0012
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 12 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

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    90143-0056

Molex Electronics Ltd.
Part No. 90143-0056
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 56 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0008

Molex Electronics Ltd.
Part No. 90143-0008
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 8 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-430
Description BERGSTIK II .100CC DR-STRAIGHT
Tech specs 　 　

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    90143-0060

Molex Electronics Ltd.
Part No. 90143-0060
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 60 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0010

Molex Electronics Ltd.
Part No. 90143-0010
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 10 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0064

Molex Electronics Ltd.
Part No. 90143-0064
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 64 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. GSD090143HR
Description Sd Card Connector, Push-push Type, 9 Position.
Tech specs 　 　

Official Product Page

    90143-0016 90143-0018

Molex Electronics Ltd.
Part No. 90143-0016 90143-0018
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 16 Circuits
2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 18 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 10120818-001CLF
Description SAS 3.0 Connectors, Storage & Server System, Receptacle, Vertical, Surface Mount, 29 Positions, 12Gb/s.
Tech specs 　 　

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    0901430140

Molex Electronics Ltd.
Part No. 0901430140
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 40 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 40 Circuits
File Size 250.45K  /  2 Page

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Amphenol Communications Solutions
Part No. 76350-120-22LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 22 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    0901430134

Molex Electronics Ltd.
Part No. 0901430134
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 34 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 34 Circuits
File Size 250.45K  /  2 Page

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Amphenol Communications Solutions
Part No. 93690-101-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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