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  90136-2208 Datasheet PDF File

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    90136-2132

Molex Electronics Ltd.
Part No. 90136-2132
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.43K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TB62208FNG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=1.8/Phase Interface
Tech specs 　 　

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HUA FENG CIRCUIT





    90136-2310

Molex Electronics Ltd.
Part No. 90136-2310
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 254.44K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TB62208FTG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=1.8/Phase Interface
Tech specs 　 　

Official Product Page

    90136-1325

Molex Electronics Ltd.
Part No. 90136-1325
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 25 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 159.22K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TB62208FG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=1.8/Phase Interface
Tech specs 　 　

Official Product Page

    90136-1212

Molex Electronics Ltd.
Part No. 90136-1212
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 159.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs 　 　

Official Product Page

    90136-1210

Molex Electronics Ltd.
Part No. 90136-1210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 159.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    90136-2118

Molex Electronics Ltd.
Part No. 90136-2118
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    90136-2218

Molex Electronics Ltd.
Part No. 90136-2218
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 254.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 77313-422-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
Tech specs 　 　

Official Product Page

    90136-2215

Molex Electronics Ltd.
Part No. 90136-2215
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 15 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 254.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 10144642-208KLF
Description Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 8 Position,side to side double row,Top latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs 　 　

Official Product Page

    90136-1322

Molex Electronics Ltd.
Part No. 90136-1322
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 159.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 77313-822-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
Tech specs 　 　

Official Product Page

    90136-2230

Molex Electronics Ltd.
Part No. 90136-2230
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 254.33K  /  5 Page

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Amphenol Communications Solutions
Part No. 71922-208BLF
Description Quickie, Wire to Board connectors, Double Row, 8 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 0.76 ?m (30 ?in.) Gold or GXT Plating, Black color
Tech specs 　 　

Official Product Page

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