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  87834-1611 Datasheet PDF File

For 87834-1611 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87834-4095

Molex Electronics Ltd.
Part No. 87834-4095
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.34K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6116-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87834-4092

Molex Electronics Ltd.
Part No. 87834-4092
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Plating, End Windows

File Size 100.59K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6116-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    87834-4045

Molex Electronics Ltd.
Part No. 87834-4045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00012T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
Tech specs    

Official Product Page

    87834-2421

Molex Electronics Ltd.
Part No. 87834-2421
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00030T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 30 contacts
Tech specs    

Official Product Page

    87834-4093

Molex Electronics Ltd.
Part No. 87834-4093
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.76μm (30μ) Gold (Au) Plating, End Windows

File Size 100.60K  /  3 Page

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Amphenol Communications Solutions

Part No. 87916-113HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

    87834-4021

Molex Electronics Ltd.
Part No. 87834-4021
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00040T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
Tech specs    

Official Product Page

    87834-3011

Molex Electronics Ltd.
Part No. 87834-3011
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 30 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 87916-111HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

    87834-3041

Molex Electronics Ltd.
Part No. 87834-3041
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00008T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 8 contacts
Tech specs    

Official Product Page

    87834-3019

Molex Electronics Ltd.
Part No. 87834-3019
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 30 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.08K  /  3 Page

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Amphenol Communications Solutions

Part No. U90H161100A
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP 12.73MM HS 1X1.
Tech specs    

Official Product Page

    87834-2419

Molex Electronics Ltd.
Part No. 87834-2419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 24 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3516-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 87834-1611 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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