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TK1814M 87C054 F1535A 7454D OP07EP 07M002 F20J1R0E 744202
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  87758-2016 Datasheet PDF File

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    87758-1617

Molex Electronics Ltd.
Part No. 87758-1617
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Murata Manufacturing Co Ltd

Part No. DFE2016CKA-2R2M=P2
Description Fixed IND 2.2uH 1400mA NONAUTO
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87758-1417

Molex Electronics Ltd.
Part No. 87758-1417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 14 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.75K  /  4 Page

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Murata Manufacturing Co Ltd

Part No. DFE2016CKA-1R0M=P2
Description Fixed IND 1uH 1800mA NONAUTO
Tech specs    

Official Product Page

    87758-1416

Molex Electronics Ltd.
Part No. 87758-1416
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1622LPCLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, LCP, GW Compatible, With Pegs, Tape and Reel with cap.
Tech specs    

Official Product Page

    87758-4216

Molex Electronics Ltd.
Part No. 87758-4216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 68020-162HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87758-3417

Molex Electronics Ltd.
Part No. 87758-3417
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 67292-016LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    87758-2217

Molex Electronics Ltd.
Part No. 87758-2217
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 22 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 22 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-809201650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87758-3050

Molex Electronics Ltd.
Part No. 87758-3050
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 30 Circuits

File Size 135.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1621LPLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 16 Positions, LCP, GW Compatible, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    87758-3816

Molex Electronics Ltd.
Part No. 87758-3816
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127720-162LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 16 Positions, Gold Flash plating, Non GW Compatible LCP, With Pegs, Tray Packing.
Tech specs    

Official Product Page

    87758-2450

Molex Electronics Ltd.
Part No. 87758-2450
Description 2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1622PLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    87758-2417

Molex Electronics Ltd.
Part No. 87758-2417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 67292-016
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

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