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  73780-3163 Datasheet PDF File

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    73780-2163

Molex Electronics Ltd.
Part No. 73780-2163
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.511), Pin Length 4.00mm (.157),
File Size 198.70K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-163402PLF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    73780-2155

Molex Electronics Ltd.
Part No. 73780-2155
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits
File Size 198.70K  /  3 Page

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Amphenol Communications Solutions
Part No. 91901-31631LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 31 Positions.
Tech specs 　 　

Official Product Page

    73780-3157

Molex Electronics Ltd.
Part No. 73780-3157
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.50mm (.138),
File Size 198.71K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-6316-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    73780-3147

Molex Electronics Ltd.
Part No. 73780-3147
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits
File Size 193.90K  /  3 Page

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Amphenol Communications Solutions
Part No. 75168-316-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    73780-3253

Molex Electronics Ltd.
Part No. 73780-3253
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 13.00mm (.512), Pin Length 3.50mm (.138),
File Size 198.70K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-163400LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs 　 　

Official Product Page

    73780-3255

Molex Electronics Ltd.
Part No. 73780-3255
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits
File Size 198.71K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-163422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs 　 　

Official Product Page

    73780-3145

Molex Electronics Ltd.
Part No. 73780-3145
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 15.00mm (.591), Pin Length 3.00mm (.118),
File Size 198.42K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-163402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs 　 　

Official Product Page

    73780-2166

Molex Electronics Ltd.
Part No. 73780-2166
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 16.00mm (.630), Pin Length 4.00mm (.157),
File Size 194.17K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-163622LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs 　 　

Official Product Page

    73780-2165

Molex Electronics Ltd.
Part No. 73780-2165
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 15.00mm (.591), Pin Length 4.00mm (.157),
File Size 209.12K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-6314-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

    73780-2164

Molex Electronics Ltd.
Part No. 73780-2164
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 14.00mm (.551), Pin Length 4.00mm (.157),
File Size 194.17K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-6318-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

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