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  7054 Datasheet PDF File

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    70545-0010

Molex Electronics Ltd.
Part No. 70545-0010
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 11 Circuits, Tin (Sn) Plating

File Size 252.54K  /  5 Page

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Amphenol Communications Solutions

Part No. 10136647-054232LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Black Color, 5 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70545-0053

Molex Electronics Ltd.
Part No. 70545-0053
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 19 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Platin

File Size 252.54K  /  5 Page

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Amphenol Communications Solutions

Part No. 10136647-054132LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Natural Color, 5 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs    

Official Product Page

    70545-0052

Molex Electronics Ltd.
Part No. 70545-0052
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 18 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Platin

File Size 252.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0004

Molex Electronics Ltd.
Part No. 70545-0004
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 5 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 5 Circuits, Tin (Sn) Plating

File Size 252.70K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-417HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0049

Molex Electronics Ltd.
Part No. 70545-0049
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 15 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Platin

File Size 252.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-425HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0006

Molex Electronics Ltd.
Part No. 70545-0006
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 7 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 7 Circuits, Tin (Sn) Plating

File Size 252.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-420HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0042

Molex Electronics Ltd.
Part No. 70545-0042
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 8 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating

File Size 252.67K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-412HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0014

Molex Electronics Ltd.
Part No. 70545-0014
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 15 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 15 Circuits, Tin (Sn) Plating

File Size 252.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-424HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0017

Molex Electronics Ltd.
Part No. 70545-0017
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 18 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 18 Circuits, Tin (Sn) Plating

File Size 252.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 10136647-054121LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, 30u\\ Gold (Tin on Tails) plating, Natural Color, 5 Positions, Non GW Compatible, with Posts, Tray packing.
Tech specs    

Official Product Page

    70545-0040

Molex Electronics Ltd.
Part No. 70545-0040
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 6 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating

File Size 252.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-405HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 5 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

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