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  44067-2201 Datasheet PDF File

For 44067-2201 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    44067-0201 0440670201

Molex Electronics Ltd.
Part No. 44067-0201 0440670201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

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Amphenol Communications Solutions

Part No. 10082201-104A06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0440671001 44067-1001

Molex Electronics Ltd.
Part No. 0440671001 44067-1001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector

File Size 204.09K  /  3 Page

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Amphenol Communications Solutions

Part No. 68002-201HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0440672001 44067-2001

Molex Electronics Ltd.
Part No. 0440672001 44067-2001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 84502-201
Description 300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    0440671403 44067-1403

Molex Electronics Ltd.
Part No. 0440671403 44067-1403
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
MOLEX Connector

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 10060912-201LF
Description GIG-Array®, Mezzanine Connectors, 15mm Receptacle 200 Position Lead Free.
Tech specs    

Official Product Page

    0440672002 44067-2002

Molex Electronics Ltd.
Part No. 0440672002 44067-2002
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 10082201-101-10LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0440672402 44067-2402

Molex Electronics Ltd.
Part No. 0440672402 44067-2402
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. L17H2220125
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 9/9 (Socket/Socket), Flash Gold, Bright Tin Shell, M3 Removable Front Screwlock, 2*Arrowhead Boardlock
Tech specs    

Official Product Page

    0440671401 44067-1401

Molex Electronics Ltd.
Part No. 0440671401 44067-1401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. RJE0162201
Description Modular Jack - Right Angle, Input Output Connectors 6P2C, Shield.
Tech specs    

Official Product Page

    0440672403 44067-2403

Molex Electronics Ltd.
Part No. 0440672403 44067-2403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 10082201-404-06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    44067-1603 0440671603

Molex Electronics Ltd.
Part No. 44067-1603 0440671603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 203.98K  /  3 Page

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Amphenol Communications Solutions

Part No. 10082201-405-03LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 3 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    44067-1601 0440671601

Molex Electronics Ltd.
Part No. 44067-1601 0440671601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.11K  /  3 Page

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Amphenol Communications Solutions

Part No. 10123982-201
Description MEG-Array®, Mezzanine, 320 Positions, Receptacle, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height.
Tech specs    

Official Product Page

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