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  43650-1104 Datasheet PDF File

For 43650-1104 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43650-0621

Molex Electronics Ltd.
Part No. 43650-0621
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal

File Size 164.23K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-110402100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43650-1126

Molex Electronics Ltd.
Part No. 43650-1126
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Solder Tab, 11 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Glow Wire Compatible

File Size 170.66K  /  3 Page

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Amphenol Communications Solutions

Part No. 10127721-104LF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 10 Position, 3.2mm Kink Tail (30u\\ Gold) plating, Non GW Compatible LCP, Black Color,Tray Packing.
Tech specs    

Official Product Page

    43650-1124

Molex Electronics Ltd.
Part No. 43650-1124
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Solder Tab, 11 Circuits, Tin (Sn) Plating, Glow Wire Compatible

File Size 170.59K  /  3 Page

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Amphenol Communications Solutions

Part No. G832MC110403222HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 5.7 mm, 40 Positions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold Black.
Tech specs    

Official Product Page

    43650-1123

Molex Electronics Ltd.
Part No. 43650-1123
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Press-fit Metal Retention Clip, 11 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 163.93K  /  3 Page

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Amphenol Communications Solutions

Part No. G832MB110404122HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 6.7 mm, 40 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black.
Tech specs    

Official Product Page

    43650-0821

Molex Electronics Ltd.
Part No. 43650-0821
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit

File Size 164.47K  /  3 Page

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Amphenol Communications Solutions

Part No. G832MB110403222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 40 Positions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold Black.
Tech specs    

Official Product Page

    43650-0820

Molex Electronics Ltd.
Part No. 43650-0820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical

File Size 169.25K  /  3 Page

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Amphenol Communications Solutions

Part No. G832MC110402222HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 40 Positions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold Black.
Tech specs    

Official Product Page

    43650-0815

Molex Electronics Ltd.
Part No. 43650-0815
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 8 Circuits, Tin (Sn) Plating, Glow Wire Compatible

File Size 153.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 10082201-104A06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    43650-0811

Molex Electronics Ltd.
Part No. 43650-0811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Right Angle, with PCB Press-fit Metal Retention Clip, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 163.60K  /  3 Page

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Amphenol Communications Solutions

Part No. 68031-104HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    43650-0810

Molex Electronics Ltd.
Part No. 43650-0810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Right Angle, with PCB Press-fit Metal Retention Clip, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 163.60K  /  3 Page

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Amphenol Communications Solutions

Part No. 90311-042LF
Description Crimp-to-Wire Housing, Double Row, Pol. w/Latch, 42 Position
Tech specs    

Official Product Page

    43650-0925

Molex Electronics Ltd.
Part No. 43650-0925
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab, 9

File Size 170.66K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-811042400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 43650-1104 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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