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  43045-0806 Datasheet PDF File

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    SIRENZA[SIRENZA MICRODEVICES]
Part No. SDM-08060
Description 869-894 MHz Class AB 60W Power Amplifier Module
File Size 84.57K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

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HUA FENG CIRCUIT





    Electronic Theatre Controls, Inc.
Part No. SDM-08060
Description 869-894 MHz Class AB 60W Power Amplifier Module 869-894兆赫AB0W功率放大模块
File Size 84.64K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

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    T0806 T0806-PEQ

Atmel Corporation
Part No. T0806 T0806-PEQ
Description SPECIALTY INTERFACE CIRCUIT, QCC16
3-Channel Laser Driver with RF Oscillator and 2
File Size 238.95K  /  7 Page

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Amphenol Communications Solutions
Part No. 54202-G08-06P
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

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    Molex
Part No. 43045-XXXX
Description Single and Dual Row Micro-Fit 3.0 Connectors
File Size 81.53K  /  1 Page

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Amphenol Communications Solutions
Part No. 75160-806-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,10 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    87914-0806

Molex Electronics Ltd.
Part No. 87914-0806
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size 759.80K  /  11 Page

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Amphenol Communications Solutions
Part No. 57102-F08-06LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 12 Positions - 2mm (0.079inch) - Vertical
Tech specs 　 　

Official Product Page

    90814-0806

Molex Electronics Ltd.
Part No. 90814-0806
Description 1.27mm (.050) Pitch Picoflex PF-50 SMT Header, Vertical, Low Profile, Surface Mount
File Size 236.79K  /  4 Page

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Amphenol Communications Solutions
Part No. 54102-G0806LF
Description 54102-G0806LF-DUPLEX
Tech specs 　 　

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    43045-1220

Molex Electronics Ltd.
Part No. 43045-1220
Description
File Size 175.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-101080600RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    43045-0601

Molex Electronics Ltd.
Part No. 43045-0601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits
File Size 190.62K  /  3 Page

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Amphenol Communications Solutions
Part No. 68020-408-061033LF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1820

Molex Electronics Ltd.
Part No. 43045-1820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.82K  /  3 Page

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Amphenol Communications Solutions
Part No. 10142708-06200LF
Description Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 100u\\ Tin overall plating, GW Compatible LCP, With Pegs, Tray.
Tech specs 　 　

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    43045-1221

Molex Electronics Ltd.
Part No. 43045-1221
Description
File Size 183.78K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-808061500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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