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Amphenol Communications Solutions |
| Part No. |
54112-803080900LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-801300800LF
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| Description |
BERGSTIK STACKING
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-807161500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-811121900LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
30968-1208 0309681208
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| Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 20 Circuits, Polarization Option #2, Black
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 20 Circuits, Polarization Option #2, Black
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| File Size |
300.98K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
78511-128HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
30968-1209 0309681209
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| Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 20 Circuits, Polarization Option #3, White
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 20 Circuits, Polarization Option #3, White
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| File Size |
300.97K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54112-807361000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0309681129 30968-1129
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| Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 12 Circuits, Polarization Option #3, White
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 12 Circuits, Polarization Option #3, White
2.54mm (.100") Pitch, 0.64mm (.025") Width H-DAC 64垄芒 High Density AutomotiveCrimp Housing, Dual Row, 12 Circuits, Polarization Option #3, White
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| File Size |
301.14K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54112-812262450LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
30968-1167 0309681167
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| Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #1, Gray
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #1, Gray
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| File Size |
300.97K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
94611-128HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-811042400LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
30968-1168 0309681168
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| Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #2, Black
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #2, Black
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| File Size |
300.97K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54112-802200800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Price and Availability
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