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STW30N20 FNA23060 G530162 MP2365 070XH02 MM3Z2V FL313 61725
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  25-bump Datasheet PDF File

For 25-bump Found Datasheets File :: 3040    Search Time::1.109ms    
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    DG3537DB-T5-E1 DG3540DB-T1-E1 DG3537 DG3538 DG3538DB-T5-E1 DG3539 DG3539DB-T5-E1

Vishay Siliconix
Part No. DG3537DB-T5-E1 DG3540DB-T1-E1 DG3537 DG3538 DG3538DB-T5-E1 DG3539 DG3539DB-T5-E1
OCR Text ...+ Full 0 3 V+ 4 4.3 1.2 0.25 V 0.75 Switch Off Leakage Current f V+ = 3.6 V, VNO, VNC = 0.3 V/3.3 V, VCOM = 3.3 V/0...BUMP (3 x 3, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT) 8 x O 0.150 0.229 Note b Solder Mask O Pad Dia...
Description 4-楼?, 360-MHz, Dual SPST Analog Switches
4-Ω, 360-MHz, Dual SPST Analog Switches

File Size 125.30K  /  10 Page

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    TS8314

Taiwan Semiconductor Company, Ltd
Part No. TS8314
OCR Text ...tom of FR4 board constrained to 25 degrees C * Power dissipation = 0.4 W per quarter model, in the form of a uniform heat flux at the die ju...Bump (0.27 mm) Copper (0.0712 mm) = 2 0Z. (2.8 mils) FR4 (1.60 mm total) D S D S 1.00...
Description Bi-directional N-Channel 2.5V Specified MicroSURF垄芒

File Size 1,846.36K  /  28 Page

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    SA58671UK

NXP Semiconductors
Part No. SA58671UK
OCR Text ...erating factor 9.12 mW/K Tamb = 25 C Tamb = 75 C Tamb = 85 C Tamb Tj Tstg [1] Conditions active mode shutdown mode [1] Min -0.3 -0.3...bump WLCSP package ground bumps are soldered directly to the PCB heat spreader. By the use of therma...
Description 1.2 W/channel stereo class-D audio amplifier

File Size 175.66K  /  24 Page

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