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  1808 Datasheet PDF File

For 1808 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43045-1808

Molex Electronics Ltd.
Part No. 43045-1808
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 18 Circuits

File Size 184.24K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131318-0811100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    RAMTRON
Part No. FM1808-70-S
Description 256Kb Bytewide FRAM Memory

File Size 92.80K  /  13 Page

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Amphenol Communications Solutions

Part No. 10118085-101-10LF
Description Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

   
Part No. FM1808
Description From old datasheet system

File Size 87.97K  /  12 Page

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Amphenol Communications Solutions

Part No. 54121-808121300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. ON1808
Description From old datasheet system

File Size 85.87K  /  8 Page

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Amphenol Communications Solutions

Part No. 12401808E412A
Description USB3.2 GEN2, Type C, Top mount, CH 1.58mm, Dual Row SMT
Tech specs    

Official Product Page

    Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
Part No. DS1808
Description Process: 1P, 1M, 5.0um, 30V NF & PF, UVNd, UVPd ,N ESD,TEOS Spacer, Passivation w/Nov TEOS Oxide-Nitride 双路对数数字电位
Process: 1P, 1M, 5.0um, 30V NF & PF, UVNd, UVPd ,N ESD,TEOS Spacer, Passivation w/Nov TEOS Oxide-Nitride

File Size 10.46K  /  1 Page

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Amphenol Communications Solutions

Part No. 77313-118-08LF
Description BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Double Row, 8 Positions
Tech specs    

Official Product Page

   
Part No. FM1808-70-S
Description IC-SM-256KFRAM

File Size 115.89K  /  2 Page

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Amphenol Communications Solutions

Part No. 10118084-101A10LF
Description Unshrouded Right Angle Header, Surface Mount, Double row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    Ramtron
Part No. FM1808-70-P
Description
File Size 89.50K  /  12 Page

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Amphenol Communications Solutions

Part No. 54121-808361650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    RAMTRON
Part No. FM1808
Description 256KB BYTEWIDE FRAM MEMORY

File Size 127.12K  /  12 Page

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Amphenol Communications Solutions

Part No. 10118084-401A08LF
Description Unshrouded Right Angle Header, Surface Mount, Double row , 8 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

   
Part No. 718081
Description ORing MOSFET Controllers with Fastest Fault Isolation for Redundant Power Supplies

File Size 355.37K  /  7 Page

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Amphenol Communications Solutions

Part No. 91601-808ALF
Description DUBOX CARD CONNECTOR
Tech specs    

Official Product Page

    Diodes
Part No. AH1808-W-7 AH1808-Z-7
Description HIGH SENSITIVITY MICROPOWER HALL EFFECT SWITCH

File Size 358.83K  /  9 Page

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Amphenol Communications Solutions

Part No. 10144518-083802LF
Description BergStak® Lite 0.80mm, Board-to-Board Connector, 80 Positions, Dual Row, Vertical Header.
Tech specs    

Official Product Page

For 1808 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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Part: 1808-FG-225-RC
Maker: Critical Link LLC
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