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  1118 Datasheet PDF File

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    1118-4787 11-18-4787

Molex Electronics Ltd.
Part No. 1118-4787 11-18-4787
Description Conductor Punch

File Size 22.10K  /  1 Page

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Amphenol Communications Solutions

Part No. U77A11181001
Description SFP CAGE 1X1 TIN TRAY
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1118-4798 11-18-4798

Molex Electronics Ltd.
Part No. 1118-4798 11-18-4798
Description Combination Anvil

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. U77C11181011
Description BRIGHT TIN PLT/R EMI PIN
Tech specs    

Official Product Page

    D1118

Fuji Electric
Part No. D1118
Description Search --To 2SD1118

File Size 130.76K  /  3 Page

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Amphenol Communications Solutions

Part No. 68491-118HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Toshiba
Part No. K1118
Description Search --To 2SK1118

File Size 235.24K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-118-09LF
Description BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions
Tech specs    

Official Product Page

    1118-5073

Molex Electronics Ltd.
Part No. 1118-5073
Description Conductor Punch

File Size 22.14K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-118-19LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    SPA-1118 SPA-1118Z

SIRENZA MICRODEVICES
Part No. SPA-1118 SPA-1118Z
Description 850 MHz 1 Watt Power Amplifier with Active Bias

File Size 105.73K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-118-29LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    51118-1605

Molex Electronics Ltd.
Part No. 51118-1605
Description 4.00mm (.158) Wire-to-Wire Retainer, 16 circuits

File Size 67.27K  /  2 Page

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Amphenol Communications Solutions

Part No. 54111-118021450LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1118-5061 0011-18-5061

Molex Electronics Ltd.
Part No. 1118-5061 0011-18-5061
Description Conductor Punch

File Size 14.41K  /  1 Page

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Amphenol Communications Solutions

Part No. 54111-802030850LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    11-18-5069 0011-18-5069 1118-5069

Molex Electronics Ltd.
Part No. 11-18-5069 0011-18-5069 1118-5069
Description Conductor Punch

File Size 14.41K  /  1 Page

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Amphenol Communications Solutions

Part No. 54111-807051000LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1118-5062 0011-18-5062

Molex Electronics Ltd.
Part No. 1118-5062 0011-18-5062
Description Insulation Punch

File Size 14.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 10111837-P020001LF
Description Mini-SAS Cable Assemblies, Input Output Connectors, Out-port to In-port Keying, 8 Signal Pairs, 26 Positions.
Tech specs    

Official Product Page

For 1118 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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Part: 1115R1B
Maker: PHILIPS(飞利浦)
Pack: QFP
Stock: 388
Unit price for :
    50: $3.10
  100: $2.95
1000: $2.79

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