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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TPCP8513
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| Description |
NPN Bipolar Transistor / VCEO=80 V / IC=4 A / hFE=100~200 / VCE(sat)=0.17 V / tf=70 ns / PS-8
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| Tech specs |
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Official Product Page
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Samsung Electronic Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
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| Part No. |
KA8513B/C KA8513B KA8513C
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| Description |
FM IF RECEIVER Tantalum Conformal-Coated Capacitor; Capacitance: 2.2uF; Voltage: 16V; Case Size: 1.4x2.6 mm; Packaging: Tape & Reel 引言 Tantalum Conformal-Coated Capacitor; Capacitance: 2.2uF; Voltage: 16V; Case Size: 1.4x2.6 mm; Packaging: Tape & Reel
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| File Size |
55.13K /
6 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
87185-133HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87185-134HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87185-131HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87185-132HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87185-135HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
22-28-0031
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| Description |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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| File Size |
55.69K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
87185-136HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJE1A1885131
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| Description |
Modular Jack - Cat5e, Single Port, 8P8C, Right Angle, With Shield, With LEDs
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJE601885136N
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| Description |
Modular Jack - 8P8C, Right Angle, Cat6A, THR, Standard Profile, Single Port, Shield With Top and Side EMI Tabs, With LEDs
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJE601885135
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| Description |
Modular Jack - 8P8C, Right Angle, Cat6A, THT, Standard Profile, Single Port, Shield With Top and Side EMI Tabs, With LEDs
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| Tech specs |
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Official Product Page
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