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  0031.2203 Datasheet PDF File

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Part No. 105-2203-201
Description INTERCONNECTION DEVICE

File Size 45.08K  /  1 Page

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Amphenol Communications Solutions

Part No. 71922-034LF
Description Quickie®, Wire to Board connectors, Double Row, 34Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. SL-2203-20 SL-1203-20
Description 7 SEG NUMERIC DISPLAY, GREEN
7 SEG NUMERIC DISPLAY, RED

File Size 252.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 68002-203HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    22-28-0031

Molex Electronics Ltd.
Part No. 22-28-0031
Description KK? 254 Breakaway Header, Vertical, with Friction Lock, 3 Circuits, 0.38μm Gold (Au) Selective Plating

File Size 66.22K  /  2 Page

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Amphenol Communications Solutions

Part No. 10143702-203KLF
Description Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 3 Position,side to side,Top latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    22-28-0031

Molex Electronics Ltd.
Part No. 22-28-0031
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, with Friction Lock, 3 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 55.69K  /  5 Page

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Amphenol Communications Solutions

Part No. 61082-203602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    AVG Semiconductors(HITE...
Part No. VMMK-2203
Description E-pHEMT Amplifier in a Wafer Scale Package (1 - 10GHz)

File Size 175.66K  /  2 Page

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Amphenol Communications Solutions

Part No. 61082-203409LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

   
Part No. 22033
Description Nonvolatile Controller Chip

File Size 1,957.06K  /  52 Page

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Amphenol Communications Solutions

Part No. 61082-203422LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    VMMK-2203

Broadcom Corporation.
AVAGO TECHNOLOGIES LIMI...
Part No. VMMK-2203
Description 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package

File Size 766.56K  /  11 Page

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Amphenol Communications Solutions

Part No. 77311-822-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Honeywell International, Inc.
Part No. 52203
Description ULTRASONIC SENSOR 超声波传感器

File Size 75.20K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-422-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Agilent(Hewlett-Packard...
Part No. MR-0031.024
Description HNPCC MASTR Plus

File Size 212.16K  /  2 Page

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Amphenol Communications Solutions

Part No. 77315-422-03LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    FCS-0031

Level One
Part No. FCS-0031
Description Megapixel (1280 x 800) high-definition resolution IEEE 802.3af PoE compliant to simplify deployment and installation

File Size 354.78K  /  6 Page

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Amphenol Communications Solutions

Part No. 61082-203609LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

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