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STATSCHIP[STATS ChipPAC, Ltd.]
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| Part No. |
LFBGA-H FBGA
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| OCR Text |
...mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness * Laminate substrate based package which enables 2 and 4 layers of routing flexibility
FEATURES
* Thin, lightweight, space saving package * Flexible bod... |
| Description |
Fine Pitch Ball Grid Array
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| File Size |
555.50K /
2 Page |
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Download Datasheet
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NIC COMPONENTS CORP
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| Part No. |
NPI21S150MTRF
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| OCR Text |
...d l l 1 w w 1 t npi21s 4.80.1 3.0 0.1 0.5 0.1 0.4 0.1 5.2 0.1 5.0 0.1 6.5 max. 5.0 0.1 1.05 max. npi22s 1.25 max. npi23s 1.55 max. npi24s 2....55mm maximum height) ? surface mountable construction ? taped and reeled for automatic insertion cas... |
| Description |
1 ELEMENT, 15 uH, GENERAL PURPOSE INDUCTOR, SMD
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| File Size |
129.67K /
4 Page |
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it Online |
Download Datasheet
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Price and Availability
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