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Siemens Semiconductor G... SIEMENS[Siemens Semiconductor Group] Infineon SIEMENS AG
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| Part No. |
BSM200GB120DL 200B12L BSM200GB120 C67076-A2300-A70
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| OCR Text |
...
1400
W + 150 -40 ... + 125 0.09 0.18 2500 20 11 F 40 / 125 / 56 sec Vac mm K/W C
TC = 25 C
Chip temperature Storage temperature Thermal resistance, chip case Diode thermal resistance, chip case Insulation test voltage, t = 1min. C... |
| Description |
From old datasheet system Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; Number of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug IGBT Power Module (Low Loss IGBT Low inductance halfbridge Including fast free- wheeling diodes) IGBT功率模块(低损耗IGBT的低电感halfbridge包括快速续流二极管
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| File Size |
128.31K /
9 Page |
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