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ST Microelectronics
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| Part No. |
XRA00 XRA00-W4I/1GE
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| OCR Text |
...livery Forms
Unsawn unbumped wafers or sawn and bumped wafers
December 2004
1/38
XRA00
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .... |
| Description |
UHF, EPCglobal Class 1b, Contactless Memory Chip 96 bit ePC with Inventory and Kill Function
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| File Size |
249.29K /
38 Page |
View
it Online |
Download Datasheet
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OSRAM
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| Part No. |
F0118G
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| OCR Text |
...e (y-direction) Durchmesser des wafers Diameter of the wafer Chiphohe Die height Bondpaddurchmesser Diameter of bondpad Weitere Informationen Additional information2) Vorderseitenmetallisierung Metallization frontside Ruckseitenmetallisieru... |
| Description |
GaAs Infrared Emitting Diode
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| File Size |
65.53K /
6 Page |
View
it Online |
Download Datasheet
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Price and Availability
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