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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
SSM3K78FS
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| Description |
N-ch MOSFET, 20 V, 0.25 A, 1.1 Ω@4.5 V, SSM
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| Tech specs |
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
SSM3K76FS
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| Description |
N-ch MOSFET, 20 V, 0.8 A, 0.235 Ω@4.5 V, SSM
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| Tech specs |
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
SSM3K77FS
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| Description |
N-ch MOSFET, 20 V, 0.2 A, 2.2 Ω@4.5 V, SSM
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| Tech specs |
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
SSM3K79FS
|
| Description |
N-ch MOSFET, 30 V, 0.1 A, 3.6 Ω@4 V, SSM
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| Tech specs |
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
SSM3J78FS
|
| Description |
P-ch MOSFET, -20 V, -0.25 A, 1.4 Ω@-4.5 V, SSM
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021832-04510T1LF
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| Description |
Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 10 positions, 1.27mm (0.500in) pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-204506LF
|
| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68020-458HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 58 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67292-045LF
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| Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 90 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-204509LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
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| Tech specs |
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Official Product Page
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