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TL494CN CSC12B P6SMBJ65 20000 954UBC LX1990 KT961 LME31R
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For preclude Found Datasheets File :: 349    Search Time::0.75ms    
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    MOSA[MOSA ELECTRONICS]
Part No. MS6311ASU MS6311 MS6311ASGTR MS6311ASGU MS6311ASTR
OCR Text ...ue symmetrical decoding method, preclude zero-crossing distortion and ensures high quality audio reproduction. These unique features, combined with its exceptional performance, make the MS6311 ideally suited for use in digital audio equipme...
Description Stereo Audio DAC

File Size 96.88K  /  6 Page

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    MS6323TMGTR MS6323 MS6323ASGTR MS6323ASGU MS6323ASMGTR MS6323ASMGU MS6323ASMTR MS6323ASMU MS6323ASTR MS6323ASU MS6323TGT

MOSA[MOSA ELECTRONICS]
Part No. MS6323TMGTR MS6323 MS6323ASGTR MS6323ASGU MS6323ASMGTR MS6323ASMGU MS6323ASMTR MS6323ASMU MS6323ASTR MS6323ASU MS6323TGTR MS6323TGU MS6323TMGU
OCR Text ...ue symmetrical decoding method, preclude zerocrossing distortion and ensures high quality audio reproduction. These unique features, combined with its exceptional performance, make the MS6323 ideally suited for use in portable audio equipme...
Description 16-Bits Stereo Audio DAC Low Power Consumption Low Voltage, Excellent PSRR

File Size 159.82K  /  9 Page

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RFMD[RF Micro Devices]
RF Micro Devices, Inc.
RF MICRO DEVICES INC
Part No. NBB-X-K1 NBB-500 NBB-500-D NBB-500-E NBB-500-T1 NBB-500-T3T RFMICRODEVICESINC-NBB-500-D
OCR Text ... exercised when mounting die to preclude excess run-out on the topside. Die Wire Bonding * Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are acceptable practices for wire bonding. * All...
Description From old datasheet system
CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 4GHz 级联宽带GaAs MMIC放大器DCGHz

File Size 214.86K  /  10 Page

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RFMD[RF Micro Devices]
Part No. NBB-X-K1 NBB-300 NBB-300-D NBB-300-E NBB-300-T1
OCR Text ... exercised when mounting die to preclude excess run-out on the topside. Die Wire Bonding * Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are acceptable practices for wire bonding. * All...
Description CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 12GHz

File Size 280.15K  /  12 Page

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RFMD[RF Micro Devices]
Part No. NBB-X-K1 NBB-400 NBB-400-D NBB-400-E NBB-400-T1
OCR Text ... exercised when mounting die to preclude excess run-out on the topside. Die Wire Bonding * Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are acceptable practices for wire bonding. * All...
Description CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 8GHz

File Size 183.30K  /  10 Page

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RFMD[RF Micro Devices]
Part No. NBB-X-K1 NBB-400 NBB-400_07 NBB-400-D NBB-400-E NBB-400-T1 NBB-40007
OCR Text ... exercised when mounting die to preclude excess run-out on the topside. Die Wire Bonding * Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are acceptable practices for wire bonding. * All...
Description CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 8GHz

File Size 276.23K  /  12 Page

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RFMD[RF Micro Devices]
Part No. NBB-X-K1 NBB-500 NBB-500_07 NBB-500-D NBB-500-E NBB-500-T1 NBB-50007
OCR Text ... exercised when mounting die to preclude excess run-out on the topside. Die Wire Bonding * Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are acceptable practices for wire bonding. * All...
Description CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 4GHz

File Size 279.66K  /  12 Page

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    ALLEGRO[Allegro MicroSystems]
Part No. STR83145
OCR Text ...h holds the full-bridge mode to preclude false application of the doubler mode during brownouts, voltage droops, or missing cycles. The requirements of low transient thermal impedance and steadystate thermal resistance are satisfied in a mo...
Description LATCHED, UNIVERSAL INPUT-VOLTAGE SWITCHES

File Size 123.06K  /  8 Page

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    XILINX[Xilinx, Inc]
Part No. XC3090L XC3000L XC3020L XC3030L XC3042L XC3064L
OCR Text ...smaller device geometries might preclude operation at 5 V. 2-170 DC Characteristics Over Operating Conditions Symbol VOH VOL VOH VOL VCCPD ICCPD ICCO IIL CIN Description High-level output voltage (@ IOH = -4.0 mA, VCC min) Low-l...
Description Part of the ZERO family of 3.3 V FPGAs
XC3000L Low Voltage Logic Cell Array Family

File Size 47.60K  /  8 Page

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    FDMF6700

Fairchild Semiconductor
Part No. FDMF6700
OCR Text ...r adaptive delay tPDH(HDRV). To preclude overlap during the high-to-low transition (Q1 OFF to Q2 ON), the adaptive circuitry monitors the voltage at the SW pin. When the PWM signal goes LOW, Q1 will begin to turn OFF after some propagation ...
Description Driver plus FET Multi-chip Module

File Size 758.15K  /  13 Page

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