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For particles Found Datasheets File :: 951    Search Time::1.235ms    
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    RA30H0608M RA30H0608M-01 RA30H0608M-E01

Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Part No. RA30H0608M RA30H0608M-01 RA30H0608M-E01
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description 68-88MHz 30W 12.5V MOBILE RADIO 68 - 88MHz功率30W 12.5V移动通信

File Size 56.04K  /  9 Page

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    RA30H1317M RA30H1317M-01 RA30H1317M-E01

Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Part No. RA30H1317M RA30H1317M-01 RA30H1317M-E01
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description 135-175MHz 30W 12.5V MOBILE RADIO

File Size 63.63K  /  9 Page

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    RA30H3340M RA30H3340M-01 RA30H3340M-E01

Mitsubishi Electric, Corp.
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA30H3340M RA30H3340M-01 RA30H3340M-E01
OCR Text ...than 50m (not flat heat sink or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when screwing or later when thermal expansion forces are added). Thermal com...
Description MITSUBISHI RF MOSFET MODULE 三菱射频MOSFET模块

File Size 71.36K  /  9 Page

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    RA30H4452M RA30H4452M-01 RA30H4452M-E01

Mitsubishi Electric Semicon...
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric, Corp.
Part No. RA30H4452M RA30H4452M-01 RA30H4452M-E01
OCR Text ...than 50m (not flat heat sink or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when screwing or later when thermal expansion forces are added). Thermal com...
Description 440-520MHz 30W 12.5V MOBILE RADIO 440 - 520MHz的功0W 12.5V移动通信

File Size 87.29K  /  9 Page

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    M75010

List of Unclassifed Manufacturers
N.A.
ETC[ETC]
Electronic Theatre Controls, Inc.
Part No. M75010
OCR Text ...ense scattered light from smoke particles. A variable-gain photo amplifier can be directly interfaced to an infrared emitter / detector pair. The amplifier gain levels are determined by two external capacitors that are then internally selec...
Description PHOTOELECTRIC SMOKE DETECTOR WITH INTERCONNECT

File Size 164.69K  /  10 Page

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    PANASONIC[Panasonic Semiconductor]
Part No. PNZ331F
OCR Text ...netic radiation or heavy-charge particles. Note 3) The glass strength of this product cannot withstand loads of 0.5 kg or greater. This fact needs to be taken into consideration if optical fibers are to be mounted on the product. *1 Measure...
Description PIN Photodiode

File Size 55.25K  /  3 Page

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    RA07H3340M RA07H3340M-E01 RA07H3340M-01

Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07H3340M RA07H3340M-E01 RA07H3340M-01
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description MITSUBISHI RF MOSFET MODULE 330-400MHz 7W 12.5V PORTABLE/ MOBILE RADIO
From old datasheet system

File Size 61.64K  /  9 Page

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    RA08N1317M RA08N1317M-01 RA08N1317M-E01

Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA08N1317M RA08N1317M-01 RA08N1317M-E01
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description Anti-Static Storage Bags; External Height:6"; External Width:4"; Features:Zipper closure, amine-free, noncorrosive; Material:Vapor-Coated Alum. Shield Bonded between Polyester Outer & Polyethylene Inner Layers RoHS Compliant: NA
Anti-Static Storage Bags; External Height:10"; External Width:6"; Features:Zipper closure, Amine-free, noncorrosive; Material:Vapor-Coated Alum. Shield Bonded between Polyester Outer & Polyethylene Inner Layers RoHS Compliant: NA
135-175MHz 8W 9.6V PORTABLE RADIO

File Size 61.86K  /  9 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA20H8994M-E01 RA20H8994M-01 RA20H8994M
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description 896-902/ 935-941MHz 20W 12.5V, 3 Stage Amp. For MOBILE RADIO
896-902/ 935-941MHz 20W 12.5V 3 Stage Amp. For MOBILE RADIO

File Size 64.64K  /  8 Page

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    TDA1574T

NXP Semiconductors
Philips Semiconductors
Part No. TDA1574T
OCR Text ...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f...
Description Integrated FM tuner for radio receivers

File Size 103.62K  /  13 Page

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For particles Found Datasheets File :: 951    Search Time::1.235ms    
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