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mil-std-1686 Datasheet PDF File

For mil-std-1686 Found Datasheets File :: 257 Search Time::3.297ms
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				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LP3000SOT89-3 LP3000SOT89 LP3000SOT89-1 LP3000SOT89-2
OCR Text	...ontrol measures can be found in mil-std-1686 and MIL-HDBK-263. APPLICATIONS NOTES & DESIGN DATA Applications Notes are available from your local Filtronic Sales Representative or directly from the factory. Complete design data, including S-...
Description	LOW NOISE, HIGH LINEARITY PACKAGED PHEMT LOW NOISE HIGH LINEARITY PACKAGED PHEMT LOW NOISE/ HIGH LINEARITY PACKAGED PHEMT
File Size	43.62K / 3 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FPD2250 FPD22501
OCR Text	...n wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260C. ORDERING INFORMATION: PART NUMB...STD-1686 and MILHDBK-263. APPLICATION NOTES & DESIGN DATA: Application Notes and design data inc...
Description	1.5W POWER PHEMT
File Size	107.51K / 3 Page	View it Online	Download Datasheet

				Filtronic Compound Semicond... Filtronic Compound Semiconductors
Part No.	FPD1050SOT89 FPD1050SOT89E FPD1050SOT891
OCR Text	...ontrol measures can be found in mil-std-1686 and MIL-HDBK-263. APPLICATION NOTES & DESIGN DATA: PCB Foot Print Application Notes and design data including Sparameters are available on request. DISCLAIMERS: This product is not d...
Description	LOW NOISE HIGH LINEARITY PACKAGED PHEMT
File Size	95.18K / 3 Page	View it Online	Download Datasheet

				Filtronic Compound Semicond... Filtronic Compound Semiconductors
Part No.	FPD1050 FPD10501
OCR Text	...n wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260C. PART NUMBER FPD1050 DESCRIPTION...STD-1686 and MILHDBK-263. APPLICATION NOTES & DESIGN DATA: Application Notes and design data inc...
Description	0.75W POWER PHEMT
File Size	98.50K / 3 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FPD7501
OCR Text	...n wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260C. PART NUMBER FPD750 DESCRIPTION ...STD-1686 and MILHDBK-263. APPLICATION NOTES & DESIGN DATA: Application Notes and design data inc...
Description	0.5W POWER PHEMT
File Size	95.34K / 3 Page	View it Online	Download Datasheet

				Filtronic Compound Semicond... Filtronic Compound Semiconductors
Part No.	FPD76121 FPD7612
OCR Text	...n wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260C. FPD7612 DESCRIPTION Die HAN...STD-1686 and MILHDBK-263. APPLICATION NOTES & DESIGN DATA: Application Notes and design data inc...
Description	GENERAL PURPOSE PHEMT
File Size	104.36K / 4 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	LP7512P70
OCR Text	...ontrol measures can be found in mil-std-1686 and MIL-HDBK-263. APPLICATIONS NOTES & DESIGN DATA Applications Notes are available from your local Filtronic Sales Representative or directly from the factory. Complete design data, including S-...
Description	PACKAGED ULTRA LOW NOISE PHEMT
File Size	50.22K / 3 Page	View it Online	Download Datasheet

For mil-std-1686 Found Datasheets File :: 257 Search Time::3.297ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |