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New Japan Radio
Part No. NJM2393D
OCR Text ... : 114.3mm 76.2mm 1.6mm(2 layer fr-4) : conform to eia/jedec (*2) at on pc board :114.3mm 76.2mm 1.6mm(4 layer fr-4) : conform to eia/jedec power dissipation vs. ambient temperature 0 200 400 600 800 1000 0255075100 ambi...
Description 1.5 A SWITCHING REGULATOR, 150 kHz SWITCHING FREQ-MAX, PDIP8
Step-Down PWM DC/DC Converter IC

File Size 128.96K  /  7 Page

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    IR2101

IRF[International Rectifier]
Part No. IR2101
OCR Text ...of Gate Oxide Connections First Layer Second Layer Contact Hole Dimension Insulation Layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description HIGH AND LOW SIDE DRIVER

File Size 357.98K  /  6 Page

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    IR2112

International Rectifier
Part No. IR2112
OCR Text ...of Gate Oxide Connections First Layer Second Layer Contact Hole Dimension Insulation Layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description HIGH AND LOW SIDE DRIVER

File Size 379.67K  /  14 Page

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    IR2113

IRF[International Rectifier]
Part No. IR2113
OCR Text ...of Gate Oxide Connections First Layer Second Layer Contact Hole Dimension Insulation Layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description HIGH AND LOW SIDE DRIVER

File Size 388.64K  /  14 Page

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    IR2117

IRF[International Rectifier]
Part No. IR2117
OCR Text ...of Gate Oxide Connections First Layer Second Layer Contact Hole Dimension Insulation Layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description SINGLE CHANNEL DRIVER

File Size 219.94K  /  7 Page

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    IR2127

International Rectifier
Part No. IR2127
OCR Text ...of Gate Oxide Connections First Layer Second Layer Contact Hole Dimension Insulation Layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description CURRENT SENSING SINGLE CHANNEL DRIVER

File Size 187.77K  /  6 Page

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    IR2153

International Rectifier
Part No. IR2153
OCR Text ...of Gate Oxide Connections First Layer Second Layer Contact Hole Dimension Insulation Layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description SELF-OSCILLATING HALF-BRIDGE DRIVER

File Size 209.66K  /  8 Page

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    INTERSIL[Intersil Corporation]
Part No. TB423 EL7562
OCR Text ... 0.5" 1" FIGURE 1. TOP LAYER 0.5" 1" FIGURE 2. TOP SILKSCREEN 4 Technical Brief 423 Demo Board Layout for VIN = 5V (Continued) 0.5" 1" FIGURE 3. BOTTOM LAYER 0.5" 1" FIGURE 4. BOTTOM SILKSCREEN ...
Description The EL7562 is a Buck (Step Down) DC:DC controller with integrated synchronous MOSFETs in a 16-pin QSOP package.

File Size 627.64K  /  7 Page

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    Integrated Circuit Syst...
ICST[Integrated Circuit Systems]
Part No. TBD 85222A02 ICS85222-02 ICS85222AM-02 ICS85222AM-02LF ICS85222AM-02LFT ICS85222AM-02T
OCR Text ...ear feet per minute and a multi-layer board, the appropriate value is 103.3C/W per Table 5 below. Therefore, Tj for an ambient temperature of 70C with all outputs switching is: 70C + 0.460W * 103.3C/W = 117.5C. This is below the limit of 12...
Description    1-TO-2 LVCMOS / LVTTL-TO DIFFERENTIAL HSTL TRANSLATOR

File Size 118.65K  /  10 Page

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    ICST[Integrated Circuit Systems]
Part No. TBD 3011C ICS843011C ICS843011CG ICS843011CGLF ICS843011CGLFT ICS843011CGT
OCR Text ... 1 meter per second and a multi-layer board, the appropriate value is 90.5C/W per Table 7 below. Therefore, Tj for an ambient temperature of 85C with all outputs switching is: 85C + 0.266W * 90.5C/W = 109.1C. This is well below the limit of...
Description FEMTOCLOCKS-TM CRYSTAL-TO- 3.3V LVPECL CLOCK GENERATOR

File Size 151.07K  /  11 Page

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