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  heating cooling Datasheet PDF File

For heating cooling Found Datasheets File :: 2883    Search Time::0.641ms    
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    ONSEMI[ON Semiconductor]
Part No. MMFT960T1
OCR Text ...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. 80 0.0 Figure...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description Power MOSFET 300 mA, 60 Volts

File Size 78.46K  /  8 Page

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    MBRB1545CT MBRB1545CT_D ON0431 06F9755

Motorola Mobility Holdings, Inc.
ON Semi
MOTOROLA[Motorola, Inc]
Part No. MBRB1545CT MBRB1545CT_D ON0431 06F9755
OCR Text ...data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperat...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description CAP SM CER 68PFD 50V 5% NPO 0603 7.5 A, 45 V, SILICON, RECTIFIER DIODE
DIODE SCHOTTKY 2X7.5A
SWITCHMODE Power Rectifier D2PAK Surface Mount Power Package
15 AMPERES 45 VOLTS
From old datasheet system
SWITCHMODE⑩ Power Rectifier D2PAK Surface Mount Power Package

File Size 107.86K  /  6 Page

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    2SA1774-D

ON Semiconductor
Part No. 2SA1774-D
OCR Text ...data sheet. when using infrared heating with the reflow soldering method, the difference should be a maximum of 1 0 c. 2sa1774 http://ons...cooling 200 c 150 c 100 c 50 c time (3 to 7 minutes total) t max solder is liquid for 40 to 80 s...
Description PNP Silicon General Purpose Amplifier Transistor

File Size 51.12K  /  8 Page

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    MAX852008 MAX8521EWX

Maxim Integrated Products
Part No. MAX852008 MAX8521EWX
OCR Text ...nt, requiring a small amount of heating or cooling. An analog control signal precisely sets the TEC current. Both devices feature accurate, individually-adjustable heating current limit and cooling current limit along with maximum TEC volta...
Description Smallest TEC Power Drivers for Optical Modules

File Size 333.80K  /  18 Page

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    Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. LSC2110-622-ST LSC2110-622 LSC2110-622-BI LSC2110-622-DN LSC2110-622-FP LSC2110-622-SA LSC2110-622-SC LSC2110-622-SF
OCR Text ...ns Tc = -40C to +85C, T = +65C (heating) T = -40C (cooling), CW, Pf = 2.5 mW unless otherwise stated Min. Max. Units Threshold Current Peak Optical Output Power Optical Output Power Slope Efficiency Forward Voltage Differential Resistanc...
Description 2.5 mW 14 Pin DIL Cooled Laser Module

File Size 106.48K  /  6 Page

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    MSD602-RT1-D

ON Semiconductor
Part No. MSD602-RT1-D
OCR Text ...data sheet. when using infrared heating with the reflow soldering method, the difference should be a maximum of 10 c. mm inches 0.039 1.0 0...cooling 200 c 150 c 100 c 50 c time (3 to 7 minutes total) t max solder is liquid for 40 to 80 s...
Description NPN General Purpose Amplifier Transistor Surface Mount

File Size 44.00K  /  4 Page

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    MMBT1010LT1 MSD1010T1

Leshan Radio Company, Ltd.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MMBT1010LT1 MSD1010T1
OCR Text ...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description PNP GENERAL PURPOSE DRIVER TRANSISTORS SURFACE MOUNT 100 mA, 15 V, PNP, Si, SMALL SIGNAL TRANSISTOR

File Size 112.56K  /  4 Page

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For heating cooling Found Datasheets File :: 2883    Search Time::0.641ms    
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