flat ribbon pdf Datasheet P15 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : D1146 T40K20 TA8100 702EZBST 1M35V10 81512 MP408 2SA1588
	Product Description
	Full Text Search

flat ribbon Datasheet PDF File

For flat ribbon Found Datasheets File :: 1869 Search Time::3.5ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

				Hittite Microwave Corporation
Part No.	HMC13707
OCR Text	...ing surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 de...ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC...
Description	GaAs MMIC BI-PHASE MODULATOR, 6 - 11 GHz
File Size	454.61K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC20307 HMC203
OCR Text	...ing surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C ...ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 14 - 23 GHz
File Size	113.18K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-XDH158
OCR Text	...ing surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C ...ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC...
Description	GaAs MMIC X4 ACTIVE FREQUENCY MULTIPLIER, 54 - 64 GHz OUTPUT
File Size	190.21K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-MDB207
OCR Text	...ing surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C ...ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC...
Description	GaAs MMIC I/Q MIXER 55 - 64 GHz
File Size	237.64K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-XDB112
OCR Text	...ing surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C ...ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC...
Description	GaAs MMIC PASSIVE FREQUENCY DOUBLER, 10 - 15 GHz INPUT
File Size	154.20K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC26307
OCR Text	...ing surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C ...ribbon bond (RF ports) 0.076mm x 0.013mm (3 mil x 0.5 mil) size is recommended. Thermosonic wirebond...
Description	GaAs MMIC LOW NOISE AMPLIFIER, 24 - 36 GHz
File Size	227.80K / 6 Page	View it Online	Download Datasheet

For flat ribbon Found Datasheets File :: 1869 Search Time::3.5ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |