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Amkor Technology, Inc.
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| Part No. |
CLGA
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| OCR Text |
.... This package consists of a co-fired ceramic base that has a matrix of pads on the bottom of the base. The lid for this package can be either ceramic "frit sealed" or metal "solder sealed". This IC package technology allows application and... |
| Description |
Ceramic Land Grid Array Package
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| File Size |
353.10K /
1 Page |
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it Online |
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IRC
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| Part No. |
MMC0310
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| OCR Text |
...etal GlazeTM thick film element fired at 1000C to solid ceramic substrate
High temperature dielectric coating 60/40 Solder over nickel barrier
MM SPECIFICATIONS:
IRC Type MMA0204 MMB0207 MMC0310 Maximum Power Rating 1/4W @ 70C 1W @ 7... |
| Description |
(MM Series) Cylindrical General Purpose Surface Mount Power Resistor
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| File Size |
84.25K /
2 Page |
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it Online |
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fairchild
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| Part No. |
MM74C221
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| OCR Text |
... input, and a clear input. Once fired, the output pulses are independent of further transitions of the A and B inputs and are a function of the external timing components CEXT and REXT. The pulse width is stable over a wide range of tempera... |
| Description |
Dual Monostable Multivibrator
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| File Size |
74.13K /
6 Page |
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it Online |
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Dense-Pac Microsystems
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| Part No. |
DPS128M8XXX
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| OCR Text |
..., or mounted on a 50-pin pga co-fired ceramic substrate. these devices pack 1-megabits of low-power cmos static ram in an area as small as 0.463 in 2 , while maintaining a total height as low as 0.082 inches. the slcc devices contain an in... |
| Description |
128kx8 High Speed CMOS SRAM
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| File Size |
612.32K /
10 Page |
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it Online |
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Price and Availability
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