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				Silicon Laboratories Inc.
Part No.	SI3200-FS SI3200-BS SI3200-GS SI3200-KS
OCR Text	...-designed PCB heat slug (copper fill) structure under the Si3200 package. The heat slug must be, as much as possible, contiguous with the system GND fill on the top circuit layer underneath the Si3200 package. The heat slug should be connec...
Description
File Size	76.40K / 8 Page	View it Online	Download Datasheet

				SGS Thomson Microelectronics
Part No.	AN1015
OCR Text	...completely. For extra security, fill the unused memory locations with code that forces a watchdog reset or jumps to a known program location if you do not want to generate a reset. This will ensure that even if the program counter is corrup...
Description	MCUS - SOFTWARE TECHNIQUES FOR IMPROVING MICROCONTROLLER EMC PERFORMANCE
File Size	89.73K / 14 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. Philips Semiconductors
Part No.	SC68C562_2 SC68C562 SC68C562C1 SC68C562C1N SC68C562C1A SC68C562A8A
OCR Text	...orities - Interrupt at any FIFO fill level - Maskable interrupt conditions * FIFO'd status bits * Watchdog timer * Multi-function programmable 16-bit counter/timer - Bit rate generator - Event counter - Count received or transmitted cha...
Description	Pressure Transducer, Series 19 mm, Compensated, Pressure Range: 0 psi to 50 psi, Absolute, flush mount with flange, 10 Vdc excitation 2 CHANNEL(S), 8M bps, MULTI PROTOCOL CONTROLLER, PQCC52 CMOS dual universal serial communications controller (CDUSCC)(CMOS 双通用串行通信控制CDUSCC)) CMOS dual universal serial communications controller CDUSCC From old datasheet system
File Size	168.20K / 26 Page	View it Online	Download Datasheet

				Hamamatsu Corporation
Part No.	S9978
OCR Text	... pixel size: 24 24 m l 100 % fill factor l wide dynamic range l low dark current l low readout noise l mpp operation applications l astronomy l scientific measuring instrument l fluorescence spectrometer l raman spectrophotometer l o...
Description	CCD area image sensor
File Size	190.25K / 6 Page	View it Online	Download Datasheet

				Apex Microtechnology Corporation
Part No.	EK57
OCR Text	...UT side" of the PCB. Be sure to fill the holes with solder. 8. Mount the terminal strip to the "component side" of the PCB. Make sure the terminal strip is fully seated and solder the pins from the "DUT side" of the PCB. Be sure to fill the...
Description	EVALUATION KIT FOR MP108FD & MP111FD PINUOT
File Size	1,040.09K / 4 Page	View it Online	Download Datasheet

				SGS Thomson Microelectronics
Part No.	AN1553
OCR Text	...oes not require any extra under fill to increase reliability performances or to protect the device. Furthermore, this package is compatible with existing pick and place equipment for board mounting. The purpose of this document is to descri...
Description	FLIP CHIP 300MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIER
File Size	68.17K / 6 Page	View it Online	Download Datasheet

				SGS Thomson Microelectronics
Part No.	AN1547
OCR Text	...oes not require any extra under fill to increase reliability performances or to protect the device. Furthermore, this package is compatible with existing pick and place equipment for board mounting. The purpose of this document is to descri...
Description	FLIP CHIP 170MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIERS
File Size	68.82K / 6 Page	View it Online	Download Datasheet

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