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  DSSK40-004B Datasheet PDF File

For DSSK40-004B Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    KMM53216004BKG KMM53216004BK

Samsung semiconductor
Part No. KMM53216004BKG KMM53216004BK
Description
File Size 400.77K  /  19 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TTA004B
Description PNP Bipolar Transistor / VCEO=-160 V / IC=-1.5 A / hFE=140~280 / VCE(sat)=-0.5 V / TO-126N
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    KMM53616004BKG KMM53616004BK

SAMSUNG[Samsung semiconductor]
Part No. KMM53616004BKG KMM53616004BK
Description 16M x 36 DRAM SIMM Using 16Mx4 & 16Mx1, 4K Refresh, 5V

File Size 407.09K  /  19 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TTC004B
Description NPN Bipolar Transistor / VCEO=160 V / IC=1.5 A / hFE=140~280 / VCE(sat)=0.5 V / TO-126N
Tech specs    

Official Product Page

    KMM53632004BKG KMM53632004BK

SAMSUNG[Samsung semiconductor]
Part No. KMM53632004BKG KMM53632004BK
Description 32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V

File Size 433.74K  /  19 Page

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Amphenol Communications Solutions

Part No. 10129381-916004BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ST Microelectronics
Part No. STTS2004B2DN3F
Description 2.2 V memory module temperature sensor with a 4 Kb SPD EEPROM

File Size 1,155.84K  /  58 Page

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Amphenol Communications Solutions

Part No. 10129381-950004BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. KMM5324004BSWG KMM5324004BSW
Description 4M x 32 DRAM SIMM Using 4Mx16, 4K Refresh, 5V

File Size 393.13K  /  19 Page

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Amphenol Communications Solutions

Part No. 10129378-905004BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Verticl Header, Through Hole, Single Row, 5 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. KMM5328004BSWG KMM5328004BSW
Description 8M x 32 DRAM SIMM Using 4Mx16, 4K Refresh, 5V

File Size 397.76K  /  19 Page

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Amphenol Communications Solutions

Part No. 10129379-903004BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    KMM53232004BK KMM53232004BKG

Samsung semiconductor
Part No. KMM53232004BK KMM53232004BKG
Description
File Size 411.88K  /  19 Page

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Amphenol Communications Solutions

Part No. 10129379-920004BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ST Microelectronics
STMicroelectronics N.V.
Part No. M29W004BT M29W004BT55N6T
Description 4 Mbit 512Kb x8 / Boot Block Low Voltage Single Supply Flash Memory
4 Mbit 512Kb x8, Boot Block Low Voltage Single Supply Flash Memory 4兆位512KB的8,启动块低压单电源闪

File Size 159.63K  /  20 Page

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Amphenol Communications Solutions

Part No. 10129382-906004BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 6 Positions, 2.54mm Pitch, 8.08mm (0.318inch) Mating, 2.29mm (0.09inch) Tail
Tech specs    

Official Product Page

    Advanced Micro Devices, Inc.
ADVANCED MICRO DEVICES INC
SPANSION LLC
Part No. AM29LV004BT-80FE AM29LV004BB-80EI AM29LV004BT-80FC AM29LV004BB-80FC AM29LV004BB-80EC AM29LV004BT-70RFI AM29LV004BT-70RFC AM29LV004BT-70REC
Description 4 Megabit (512 K x 8-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory 512K X 8 FLASH 3V PROM, 80 ns, PDSO40
512K X 8 FLASH 3V PROM, 70 ns, PDSO40

File Size 212.75K  /  6 Page

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Amphenol Communications Solutions

Part No. 10129382-940004BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 40 Positions, 2.54mm Pitch, 8.08mm (0.318inch) Mating, 2.29mm (0.09inch) Tail
Tech specs    

Official Product Page

    KMM53216004BK KMM53216004BKG

SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. KMM53216004BK KMM53216004BKG
Description 16M x 32 DRAM SIMM Using 16Mx4, 4K Refresh, 5V

File Size 405.00K  /  19 Page

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Amphenol Communications Solutions

Part No. MUSBR2M5C004BP
Description Rugged USB Accessory, Input Output Connector, Dust Cover for Harsh USB Type C, Grey color
Tech specs    

Official Product Page

For DSSK40-004B Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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