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Amphenol Communications Solutions |
| Part No. |
54122-816523000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 52 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-124243000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Single Row, 24 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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ProMOS Technologies, Inc.
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| Part No. |
V54C3256164VDLF8IPC V54C3256404VDLF8IPC V54C3256804VDLF8IPC
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| Description |
16M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA60 ROHS COMPLIANT, MO-210, FBGA-60
64M X 4 SYNCHRONOUS DRAM, 6 ns, PBGA60 ROHS COMPLIANT, MO-210, FBGA-60
32M X 8 SYNCHRONOUS DRAM, 6 ns, PBGA60 ROHS COMPLIANT, MO-210, FBGA-60
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| File Size |
675.03K /
56 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54101-S3000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 0 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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ProMOS Technologies, Inc.
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| Part No. |
V54C3256164VDLF7IPC V54C3256404VDLF7IPC V54C3256804VDLF7IPC
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| Description |
16M X 16 SYNCHRONOUS DRAM, 5.4 ns, PBGA60 ROHS COMPLIANT, MO-210, FBGA-60
64M X 4 SYNCHRONOUS DRAM, 5.4 ns, PBGA60 ROHS COMPLIANT, MO-210, FBGA-60
32M X 8 SYNCHRONOUS DRAM, 5.4 ns, PBGA60 ROHS COMPLIANT, MO-210, FBGA-60
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| File Size |
675.24K /
56 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
48243-000LF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-124083000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54101-G3000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 0 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
48233-000LF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
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| Tech specs |
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Official Product Page
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ProMOS Technologies, Inc.
PROMOS TECHNOLOGIES INC
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| Part No. |
V54C3256164VDLF7PC V54C3256404VDLF7PC V54C3256804VDLF7PC V54C3256164VDUT7 V54C3256164VDUT7PC V54C3256404VDUT7PC V54C3256164VDUT6
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| Description |
16M X 16 SYNCHRONOUS DRAM, 5.4 ns, PBGA60 ROHS COMPLIANT, MO-210, FBGA-60
64M X 4 SYNCHRONOUS DRAM, 5.4 ns, PBGA60 ROHS COMPLIANT, MO-210, FBGA-60
32M X 8 SYNCHRONOUS DRAM, 5.4 ns, PBGA60 ROHS COMPLIANT, MO-210, FBGA-60
16M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
64M X 4 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
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| File Size |
674.51K /
56 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-424083000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
47213-000LF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-123723000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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