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  dip header solder tail shrink Datasheet PDF File

For dip header solder tail shrink Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    0010897462

Molex Electronics Ltd.
Part No. 0010897462
Description 2.54mm (.100) Pitch C-Grid? Breakaway header, Dual Row, Vertical, High Temperature, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC tail Plating, 2.72mm (.107) PC tail

File Size 421.72K  /  4 Page

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    0010897363 A-70280-0218

Molex Electronics Ltd.
Part No. 0010897363 A-70280-0218
Description 2.54mm (.100) Pitch C-Grid? Breakaway header, Dual Row, Vertical, High Temperature, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC tail Plating, 2.79mm (.110) PC tail

File Size 421.81K  /  4 Page

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    0010897622

Molex Electronics Ltd.
Part No. 0010897622
Description 2.54mm (.100) Pitch C-Grid? Breakaway header, Dual Row, Vertical, High Temperature, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC tail Plating, 2.72mm (.107) PC tail

File Size 421.82K  /  4 Page

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    0010897722

Molex Electronics Ltd.
Part No. 0010897722
Description 2.54mm (.100) Pitch C-Grid? Breakaway header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC tail Plating, 2.72mm (.107) PC tail

File Size 421.77K  /  4 Page

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    0010897620 A-70280-0111

Molex Electronics Ltd.
Part No. 0010897620 A-70280-0111
Description 2.54mm (.100) Pitch C-Grid? Breakaway header, Dual Row, Vertical, High Temperature, 62 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC tail Plating, 2.72mm (.107) PC tail

File Size 421.68K  /  4 Page

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    0010897482

Molex Electronics Ltd.
Part No. 0010897482
Description 2.54mm (.100) Pitch C-Grid? Breakaway header, Dual Row, Vertical, High Temperature, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC tail Plating, 2.72mm (.107) PC tail

File Size 421.72K  /  4 Page

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    A-70280-0215

Molex Electronics Ltd.
Part No. A-70280-0215
Description 2.54mm (.100) Pitch C-Grid? Breakaway header, Dual Row, Vertical, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC tail Plating, 2.72mm (.107) PC tail

File Size 421.83K  /  4 Page

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    010-89-7800 70280-0120 0010897800

Molex Electronics Ltd.
Part No. 010-89-7800 70280-0120 0010897800
Description 2.54mm (.100) Pitch C-Grid? Breakaway header, Dual Row, Vertical, High Temperature, 80 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC tail Plating, 2.72mm (.107) PC tail

File Size 421.76K  /  4 Page

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    70280-0103 A-70280-0103 0010897460

Molex Electronics Ltd.
Part No. 70280-0103 A-70280-0103 0010897460
Description 2.54mm (.100) Pitch C-Grid? Breakaway header, Dual Row, Vertical, High Temperature, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC tail Plating, 2.72mm (.107) PC tail

File Size 421.76K  /  4 Page

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    0702800459

Molex Electronics Ltd.
Part No. 0702800459
Description 2.54mm (.100) Pitch C-Grid? Breakaway header, Dual Row, Vertical, High Temperature, 82 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC tail Plating, 2.72mm (.107) PC tail
MOLEX Connector

File Size 283.81K  /  4 Page

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For dip header solder tail shrink Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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