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				Fairchild Semiconductor Corporation FAIRCHILD[Fairchild Semiconductor]
Part No.	RMPA0963
OCR Text	...iner grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. * Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free attachment of ...
Description	Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module From old datasheet system
File Size	117.92K / 7 Page	View it Online	Download Datasheet

				FAIRCHILD[Fairchild Semiconductor]
Part No.	RMPA5255
OCR Text	...iner grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free attachment of th...
Description	From old datasheet system 4.9-5.9 GHz WLAN Linear Power Amplifier Module
File Size	779.24K / 7 Page	View it Online	Download Datasheet

				Allegro MicroSystems
Part No.	2SA2151A
OCR Text	... may cause the case material to crack at the joint with the heatsink. Please pay special attention for this effect. When soldering the products, please be sure to minimize the working time, within the following limits: 2605C 10 s 3505C 3s ...
Description	Audio Amplification Transistor
File Size	276.26K / 7 Page	View it Online	Download Datasheet

				Allegro Micro Systems, Inc. Allegro MicroSystems
Part No.	2SA2151
OCR Text	... may cause the case material to crack at the joint with the heatsink. Please pay special attention for this effect. When soldering the products, please be sure to minimize the working time, within the following limits: 2605C 10 s 3505C 3s ...
Description	Audio Amplification Transistor
File Size	276.14K / 7 Page	View it Online	Download Datasheet

				Raytheon Company
Part No.	RMPA1951-102
OCR Text	...iner grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. K Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free attachment of ...
Description	3V PCS CDMA Power Amplifier Module 3V的个人通讯CDMA功放模块
File Size	198.23K / 17 Page	View it Online	Download Datasheet

				FAIRCHILD[Fairchild Semiconductor]
Part No.	RMPA196607 RMPA1966
OCR Text	...iner grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free attachment of th...
Description	WCDMA Band II Power Amplifier Module
File Size	181.70K / 7 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	RMPA1966
OCR Text	...iner grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free attachment of th...
Description	RMPA1966 I-Lo TM WCDMA Band II Power Amplifier Module, 1850-1910 MHz RMPA1966 I-Lo TM WCDMA Band II Power Amplifier Module, 1850-1910 MHz
File Size	504.07K / 7 Page	View it Online	Download Datasheet

For crack Found Datasheets File :: 595 Search Time::0.969ms
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