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bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 147 Search Time::2.906ms
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				MAXIM - Dallas Semiconductor
Part No.	MAX8796GTJTGA4 MAX8796GTJTGB4 MAX8796GTJTG51
OCR Text	...3 = 0.6 microns (as drawn) g. bondpad dimensions: 5 mil. sq. h. i solation dielectric: sio 2 i. die separation method: wafer saw downloaded from: http:/// max8796 maxim integrated products. all rights reserved. page 4/5 = ...
Description	1-Phase, Quick-PWM Intel IMVP-6/GMCH Controllers
File Size	63.19K / 5 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor
Part No.	MAX17028GTJ MAX17028GTJG1D MAX17028GTJT
OCR Text	...3 = 0.6 microns (as drawn) g. bondpad dimensions: 5 mil. sq. h. isolation dielectric: sio 2 i. die separation method: wafer saw maxim integrated products. all rights reserv...
Description	1-Phase Quick-PWM Intel IMVP-6.5/GMCH Controllers
File Size	31.26K / 5 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor
Part No.	MAX17428GTJ MAX17428GTJTG40
OCR Text	...3 = 0.6 microns (as drawn) g. bondpad dimensions: 5 mil. sq. h. isolation dielectric: sio 2 i. die separation method: wafer saw maxim integrated products. all rights reserv...
Description	1-Phase Quick-PWM Intel IMVP-6.5/GMCH Controllers
File Size	31.30K / 5 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	TB9408VA TB9408VA-SF-F
OCR Text	....175 0.190 0.205 mm diameter of bondpad d 0.110 mm additional information frontside metallization, anode gold backside metallization, cathode gold alloy dicing sawing die bonding technology epoxy bonding legal disclaimer notice www.vishay...
Description	Specification of GaAlAs IR Emitting Diode Chip
File Size	92.16K / 4 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	TB9414VA-14
OCR Text	...ie height h 0.19 mm diameter of bondpad d 0.11 mm additional information frontside metallization, anode aluminum backside metallization, cathode gold alloy dicing sawing die bonding technology epoxy bonding legal disclaimer notice www.vis...
Description	Specification of GaAlAs IR Emitting Diode Chip
File Size	83.84K / 4 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX811TEUS
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 37 x 31 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Si None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 mil. S...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	54.89K / 8 Page	View it Online	Download Datasheet

For bondpad Found Datasheets File :: 147 Search Time::2.906ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |