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  90663-1162 Datasheet PDF File

For 90663-1162 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    0906632303 90663-2303

Molex Electronics Ltd.
Part No. 0906632303 90663-2303
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 30 Circuits
MOLEX Connector
File Size 143.67K  /  3 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. 2SA1162
Description PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
Tech specs 　 　

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HUA FENG CIRCUIT





    0906632403 90663-2403

Molex Electronics Ltd.
Part No. 0906632403 90663-2403
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 40 Circuits
MOLEX Connector
File Size 143.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 79821-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs 　 　

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    0906632643 90663-2643

Molex Electronics Ltd.
Part No. 0906632643 90663-2643
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 64 Circuits
2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 64 Circuits
MOLEX Connector
File Size 143.68K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    0906634403 90663-4403

Molex Electronics Ltd.
Part No. 0906634403 90663-4403
Description 2.54mm (.100) Pitch QF-50?Right Angle, MIL Keying with Latch/Eject Levers, Shrouded Header
2.54mm (.100") Pitch QF-50?⒁ight Angle, MIL Keying with Latch/Eject Levers, Shrouded Header
MOLEX Connector
File Size 133.99K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

Official Product Page

    0906634163 90663-4163

Molex Electronics Ltd.
Part No. 0906634163 90663-4163
Description 2.54mm (.100) Pitch QF-50 Right Angle, MIL Keying with Latch/Eject Levers, Shrouded Header, 16 Circuits
2.54mm (.100") Pitch QF-50 Right Angle, MIL Keying with Latch/Eject Levers, Shrouded Header, 16 Circuits
MOLEX Connector
File Size 133.99K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs 　 　

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    0906634103 90663-4103

Molex Electronics Ltd.
Part No. 0906634103 90663-4103
Description 2.54mm (.100) Pitch QF-50 Right Angle, MIL Keying with Latch/Eject Levers,Shrouded Header, 10 Circuits
2.54mm (.100") Pitch QF-50 Right Angle, MIL Keying with Latch/Eject Levers,Shrouded Header, 10 Circuits
MOLEX Connector
File Size 133.99K  /  3 Page

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Amphenol Communications Solutions
Part No. 10127721-162GLF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 16 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing.
Tech specs 　 　

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    0906633301 90663-3301

Molex Electronics Ltd.
Part No. 0906633301 90663-3301
Description 2.54mm (.100) Pitch QF-50 Right Angle, MIL Keying with Latch/Eject Levers, Shrouded Header, 30 Circuits
2.54mm (.100") Pitch QF-50 Right Angle, MIL Keying with Latch/Eject Levers, Shrouded Header, 30 Circuits
File Size 188.87K  /  4 Page

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Amphenol Communications Solutions
Part No. 75168-116-20LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0906633302 90663-3302

Molex Electronics Ltd.
Part No. 0906633302 90663-3302
Description 2.54mm (.100) Pitch QF-50 Right Angle, MIL Keying with Latch/Eject Levers, Shrouded Header
2.54mm (.100") Pitch QF-50 Right Angle, MIL Keying with Latch/Eject Levers, Shrouded Header
File Size 188.87K  /  4 Page

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Amphenol Communications Solutions
Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    90663-1142 0906631142

Molex Electronics Ltd.
Part No. 90663-1142 0906631142
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 14 Circuits
2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 14 Circuits
File Size 184.53K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-3116-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    90663-1143 0906631143

Molex Electronics Ltd.
Part No. 90663-1143 0906631143
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 14 Circuits
2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 14 Circuits
File Size 184.53K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-8116-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

For 90663-1162 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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